Semiconductor Workpiece Temperature Monitoring via High Emissivity Coating

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Solution Overview

Problem

Current temperature measurement techniques for silicon workpieces in semiconductor processing are limited by silicon's variable emissivity and transparency at infrared frequencies, making it difficult to accurately measure the workpiece temperature, especially in rotating processing devices where only a portion of the workpiece is visible at a time.

Innovation Solution

A system using a high emissivity coating on a portion of the workpiece, combined with an infrared camera and controller to capture and stitch thermal images, allowing for accurate temperature measurement of multiple workpieces by minimizing the coating's impact on intrinsic temperature and enabling continuous monitoring as the workpieces rotate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a high emissivity coating is applied to the workpiece to enable accurate infrared temperature measurement, then measurement precision is improved, but the coating may affect the intrinsic temperature of the workpiece and surrounding device

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidintrinsic workpiece temperature
Core Design Contradiction:
Measurement precisionVSTemperature

Solution Approach 1:

The patent applies emissivity enhancement only to specific locations on the workpiece surface rather than the entire surface. The coating is applied to discrete regions that are visible through the aperture during rotation, allowing accurate temperature measurement without uniformly affecting the thermal properties of the entire workpiece or surrounding device.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses partial coating coverage rather than full surface coating. By applying the high emissivity coating to only the portions of the workpiece that need to be monitored and are visible through the aperture, the system achieves sufficient measurement precision while minimizing the total amount of coating material and its thermal impact on the device.

Inventive Principle:
Principle #16Partial or excessive action

2Productivity

If the workpiece is rotated to process multiple workpieces, then productivity is improved, but continuous monitoring of the entire workpiece becomes difficult

Engineering Contradiction:
Improveworkpiece processing throughputVSAvoidtemperature data completeness
Core Design Contradiction:
ProductivityVSLoss of information

Solution Approach 1:

The patent ensures continuous temperature monitoring capability during workpiece rotation by strategically placing high emissivity coating on portions of the workpiece that will be visible through the aperture at different rotation positions. This allows the infrared sensor to continuously capture temperature data throughout the rotation cycle without interruption or data gaps.

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The high emissivity coating acts as an intermediary that enhances the visibility and detectability of the workpiece surface to the infrared sensor. By applying this coating to specific regions, the system enables the infrared camera to accurately detect temperature through the aperture even when the workpiece is rotating, maintaining continuous monitoring capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If only a portion of the workpiece is visible through the aperture during rotation, then device complexity is reduced, but measurement precision of the entire workpiece deteriorates

Engineering Contradiction:
Improvemonitoring system structureVSAvoidoverall workpiece temperature uniformity
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent divides the workpiece surface into multiple segments or regions, applying high emissivity coating to specific segments that correspond to different angular positions during rotation. This segmentation allows the simple aperture-based monitoring system to capture temperature data from multiple workpiece regions throughout the rotation cycle, achieving comprehensive temperature mapping without increasing device complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate and continuous temperature measurement of silicon workpieces across a range of temperatures, improving temperature uniformity monitoring and reducing measurement errors by using a coating with nearly constant emissivity and advanced image stitching technology.

Implementation Method 1

the optical properties of silicon make the application of common infrared techniques difficult or impossible. Specifically, at certain temperatures, silicon is nearly transparent at infrared frequencies

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

Because silicon has variable emissivity in the infrared band, a temperature stable, high emissivity coating is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating

Methodology Applied
Scientific EffectEmissivity:

Data Source

PatentUS9995631B2System and method to monitor semiconductor workpiece temperature using thermal imaging
Publication Date: 2018.06.12 VARIAN SEMICON EQUIP ASSC INC
  • US9995631B2 patent drawing
  • US9995631B2 patent drawing
  • US9995631B2 patent drawing

AI summary

An improved system for measuring the temperature of a plurality of workpieces in a rotating semiconductor processing device is disclosed. Because silicon has variable emissivity in the infrared band, a temperature stable, high emissivity coating is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. Further, by limiting the amount of coating applied to the workpiece, the effect of the coating on the intrinsic temperature of the workpiece and the surrounding semiconductor processing device may be minimized. The temperature of the workpieces is measured as the workpieces pass under an aperture by capturing a thermal image of a portion of the workpiece. In certain embodiments, a controller is used to process the plurality of thermal images into a single thermal image showing all of the workpieces disposed within the semiconductor processing device.