Semiconductor Defect Inspection Using Combined X-Ray Detection
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Solution Overview
Problem
Current semiconductor defect inspection technologies face challenges in detecting defects with high sensitivity, particularly for small-scale defects and large-scale defects, as they often require separate methods and have limitations in accuracy and resolution.
Innovation Solution
A semiconductor defect inspection apparatus and method that combines transmission X-ray and fluorescent X-ray detection, using an X-ray irradiation unit, a transmission X-ray detection unit, and a fluorescent X-ray detection unit, to analyze both transmission X-ray images and fluorescent X-ray spectra concurrently, enabling the detection of small-scale and large-scale defects with enhanced sensitivity and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If transmission X-ray detection is used, then small-scale defects can be detected with high resolution, but large-scale defects cannot be detected with sufficient sensitivity
Solution Approach 1:
The patent combines transmission X-ray detection and fluorescent X-ray detection into a single inspection apparatus. The transmission X-ray detection unit detects small-scale defects with high resolution, while the fluorescent X-ray detection unit detects large-scale defects with high sensitivity. By merging these two detection methods, the apparatus achieves both high resolution for small defects and high sensitivity for large defects, resolving the technical contradiction between measurement precision and adaptability.
Solution Approach 2:
The inspection apparatus is designed to perform multiple detection functions simultaneously. It can detect both small-scale defects (via transmission X-ray) and large-scale defects (via fluorescent X-ray) using a single system. This multi-functionality allows the apparatus to adapt to different defect sizes and types, improving both measurement precision and adaptability across various inspection scenarios.
2Measurement precision
If fluorescent X-ray detection is used, then large-scale defects can be detected with high sensitivity, but small-scale defects cannot be detected with sufficient resolution
Solution Approach 1:
The patent merges fluorescent X-ray detection with transmission X-ray detection in a single apparatus. The fluorescent X-ray detection provides high sensitivity for large-scale defects, while the transmission X-ray detection provides high resolution for small-scale defects. This combination resolves the contradiction between sensitivity and resolution by allowing each detection method to excel at its optimal defect size range.
3Measurement precision
If separate inspection methods are used for small-scale and large-scale defects, then each defect type can be detected with optimized sensitivity, but the inspection process becomes complex and time-consuming
Solution Approach 1:
The patent combines multiple inspection methods (transmission X-ray and fluorescent X-ray detection) into a single integrated apparatus that operates simultaneously. This merging eliminates the need for separate inspection processes, reducing both device complexity and inspection time while maintaining optimized sensitivity for different defect types through the concurrent operation of specialized detection units.
Solution Approach 2:
The inspection apparatus performs transmission X-ray detection and fluorescent X-ray detection simultaneously and continuously in a single inspection process. This continuous action eliminates the need for sequential separate inspections, reducing inspection time and process complexity while maintaining the specialized sensitivity advantages of each detection method throughout the entire inspection process.
4Measurement precision
If multiple detection units are combined in one apparatus, then defect detection sensitivity is improved, but the apparatus complexity increases
Solution Approach 1:
The patent divides the inspection apparatus into distinct functional units: an X-ray irradiation unit, a transmission X-ray detection unit, and a fluorescent X-ray detection unit. Each unit performs a specific function, allowing for modular design and simplified maintenance. This segmentation manages apparatus complexity by organizing multiple detection units into clearly defined functional modules while maintaining the sensitivity benefits of the combined system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the sensitivity for defect detection, allowing for the identification of small-scale defects through transmission X-ray images and large-scale defects through fluorescent X-ray spectra, while also monitoring light source abnormalities, thereby improving overall defect inspection capabilities.
Implementation Method 1
an X-ray irradiation unit that irradiates the stage with X-rays
Implementation Method 2
a transmission X-ray detection unit that detects transmitted X-rays which passed through the inspection target object
Implementation Method 3
a fluorescent X-ray detection unit that detects fluorescent X-rays which are emitted from the inspection target object by irradiation with the X-rays
Data Source
AI summary
According to one embodiment, a semiconductor defect inspection apparatus includes: an object-under-examination stage on which an inspection target object is placed; an X-ray irradiation unit that irradiates the object-under-examination stage with X-rays; an imaging unit that detects transmitted X-rays which passed through the inspection target object; a fluorescent X-ray detection unit that detects fluorescent X-rays which are emitted from the inspection target object by irradiation with the X-rays; and a defect detection unit that detects a first defect by an analysis of a transmission X-ray image which is obtained by performing photoelectric conversion of the transmitted X-rays and detects a second defect by a spectrum analysis of the fluorescent X-rays.