Semiconductor Package Layout With Zoned Interconnect Density
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving both miniaturization and reliability while maintaining improved electrical characteristics and integration, particularly in system-in-package structures.
Innovation Solution
A semiconductor package design featuring a lower substrate with specific arrangements of semiconductor chips and connection structures, including a lower interconnection layer, intermediate connection structures, and an upper substrate, which optimizes signal transmission paths and minimizes ground signal connections, thereby enhancing integration and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are stacked and mounted on a package substrate (POP structure), then integration and functionality are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The package substrate is divided into multiple functional regions (first region, second region, third region) with different intermediate connection structure densities. This segmentation allows different areas to serve different purposes: high-density regions for electrical connections and low-density regions for signal transmission, thereby managing complexity while maintaining integration.
Solution Approach 2:
Different regions of the package substrate are assigned different properties: the first and third regions have high-density intermediate connection structures for electrical connections, while the second region has low-density structures optimized for signal transmission. This local differentiation resolves the contradiction by allowing each region to be optimized for its specific function.
2Reliability
If signal transmission paths are shortened to improve electrical characteristics, then electrical performance is improved, but ground signal connections must be minimized which complicates the design
Solution Approach 1:
The package substrate implements local quality differentiation by creating specific regions with different intermediate connection structure densities. The second region, positioned between the first and third regions, has reduced intermediate connection structures to serve as a dedicated signal transmission path, minimizing ground signal interference while maintaining electrical performance.
Solution Approach 2:
The intermediate connection structures serve as mediators between the semiconductor chips and the package substrate. By strategically reducing the density of these intermediate connections in the second region, the design creates optimized signal transmission paths that minimize ground signal interference while maintaining reliable electrical connections through the intermediate structures in other regions.
3Reliability
If intermediate connection structures are densely arranged to improve electrical connections, then electrical characteristics are improved, but the area occupied increases which conflicts with miniaturization
Solution Approach 1:
The package substrate is divided into regions with different intermediate connection structure densities. The first and third regions have high-density intermediate connection structures optimized for electrical connections, while the second region has low-density structures optimized for signal transmission. This local differentiation allows the substrate to achieve excellent electrical characteristics in connection-critical areas while minimizing the overall area by reducing connections only where signal transmission is prioritized.
Solution Approach 2:
The substrate area is segmented into functional zones with different connection densities. This segmentation allows the design to concentrate intermediate connection structures only where they are most needed (first and third regions), while using fewer connections in the second region where signal transmission is the priority, thereby reducing the total substrate area required while maintaining electrical performance.
Data Source
AI summary
A semiconductor package may include a lower substrate having an upper surface including first, second, and third regions and a lower interconnection layer; lower connection structures below the lower substrate; a first semiconductor chip on the second region and electrically connected to the lower interconnection layer; a second semiconductor chip adjacent to the first semiconductor chip on the second region and electrically connected to the first semiconductor chip; intermediate connection structures on the lower substrate and electrically connected to the lower interconnection layer; an upper substrate on the first semiconductor chip and the intermediate connection structures; a third semiconductor chip overlapping the first semiconductor chip; and a fourth semiconductor chip spaced apart from the third semiconductor chip and overlapping the third region, wherein a density of the intermediate connection structures on the first and third regions is greater than a density of the intermediate connection structures on the second region.