Semi-Cured Packaging Layer for Micro-LED Gap Filling
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Solution Overview
Problem
Conventional methods for packaging micro-components, such as micro LEDs, often result in incomplete filling of gaps between components due to the use of packaging fluid materials like silica gel, leading to product defects and reduced reliability.
Innovation Solution
A process involving a multi-layered structure with a semi-cured packaging material layer and eutectic metal bumps for complete encapsulation of micro-components, where the semi-cured packaging material layer is used as both a transfer medium and packaging material, allowing for precise alignment and filling of gaps through eutectic bonding and subsequent complete curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If packaging fluid material such as silica gel is used to package micro-components, then atmospheric aging resistance and ultraviolet aging resistance are improved, but gaps among micro-components may not be filled completely leading to product defects
Solution Approach 1:
The patent applies preliminary action by performing a semi-curing treatment on the packaging material layer before component packaging. This creates an adhesively semi-cured state that enables the material to flow and fill gaps between micro-components effectively, while subsequent complete curing ensures final structural integrity and gap filling completeness
Solution Approach 2:
The patent utilizes parameter changes by controlling the curing temperature and degree of the packaging material. By transitioning from a semi-cured state (lower crosslinking density, higher flexibility) to a fully cured state (higher crosslinking density, structural rigidity), the material can adapt its properties to achieve both gap filling and structural support functions
2Manufacturing precision
If conventional packaging processes are used, then packaging material can be applied, but the process is complex and gaps are not filled completely
Solution Approach 1:
The patent merges the transfer medium function and packaging material function into a single integrated layer. The packaging material layer serves dual purposes: as the transfer medium for picking up micro-components from the donor wafer and as the final packaging material that fills gaps and provides protection, eliminating the need for separate transfer medium removal steps
Solution Approach 2:
The packaging material layer exhibits multi-functionality by simultaneously serving as transfer medium, gap-filling material, and protective packaging. This universal application simplifies the overall packaging process while ensuring complete gap filling and component protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enhances packaging quality and reliability by ensuring complete encapsulation of micro-components and filling of gaps with the semi-cured packaging material, improving the overall integrity of the packaged products.
Implementation Method 1
subjecting the packaging material layer to a semi-curing treatment at a first temperature that is lower than a complete curing temperature of the packaging material layer so as to form an adhesively semi-cured packaging material layer
Implementation Method 2
subjecting the adhesively semi-cured packaging material layer of the multi-layered structure to adhesion to an array, which includes the at least one component and at least one electrode pair disposed on the at least one component
Implementation Method 3
subjecting the adhesively semi-cured packaging material layer to a complete curing treatment
Data Source
AI summary
A process for packaging at least one component includes the steps of: a) providing a substrate and a packaging material layer, b) forming the packaging material layer into an adhesively semi-cured packaging material layer, c) adhering the adhesively semi-cured packaging material layer to an array, d) providing a packaging unit including at least one eutectic metal bump pair, e) permitting the eutectic metal bump pair to be in contact with at least one electrode pair on the array, f) subjecting the electrode pair to eutectic bonding to the eutectic metal bump pair, g) encapsulating the component by pressing, h) completely curing the adhesively semi-cured packaging material layer, and i) removing the substrate.