Semidrying Light-Reflecting Frame for LED Packaging
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Solution Overview
Problem
The existing manufacturing methods for LED lamps require a prefabricated frame mold for the white frame, leading to increased costs and the need for new molds when the shape of the frame needs to be changed, limiting flexibility and efficiency.
Innovation Solution
A method of manufacturing a multichip package structure that forms a semidrying surrounding light-reflecting frame without using any frame mold, by naturally drying a surrounding liquid colloid on a substrate body to create a convex or concave junction, allowing for adjustable light-projecting angles and increased light-emitting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a prefabricated frame mold is used to manufacture the white frame, then the frame structure can be formed, but the manufacturing cost increases and the flexibility to change frame shapes is reduced
Solution Approach 1:
The patent changes the physical state of the colloid material from liquid to solid through controlled drying processes. The colloid is applied in liquid form to allow easy shaping and molding, then dried to form the solid white frame structure. This parameter change enables both cost reduction (no expensive molds needed) and shape flexibility (can be formed into any configuration).
Solution Approach 2:
The patent replaces the mechanical molding system (frame molds) with a chemical/physical process (colloid drying). Instead of using mechanical molds to shape the white frame, the invention uses a liquid colloid that is deposited and then dried to form the desired shape, eliminating the need for mechanical molding equipment and associated costs.
2Manufacturing precision
If a prefabricated frame mold is used, then the white frame can be formed with consistent shape, but new molds must be developed when shape changes are needed
Solution Approach 1:
The patent replaces the mechanical molding system with a colloid-based forming process. The liquid colloid can be precisely controlled during deposition to achieve consistent shapes, and any shape changes can be made by simply adjusting the deposition process rather than developing new physical molds, eliminating mold development time.
Solution Approach 2:
The patent applies the colloid in liquid form before drying, allowing the shape to be established during the liquid state when it is most easily formed and adjusted. This preliminary shaping action in liquid form ensures precision while maintaining flexibility for future modifications without requiring new molds.
3Ease of manufacture
If surrounding liquid colloid is naturally dried to form a semidrying surrounding light-reflecting frame, then manufacturing cost is reduced, but the drying process must be controlled to achieve proper structure
Solution Approach 1:
The patent performs preliminary shaping of the colloid while in liquid form before drying occurs. This allows the structure to be established when the material is most pliable and easy to control, ensuring manufacturing precision is achieved during the liquid state, which then maintains its form during the drying process.
Solution Approach 2:
The patent utilizes the phase transition of the colloid from liquid to solid through controlled drying. By understanding and controlling this phase transition, the invention achieves both cost reduction (simple drying process) and manufacturing precision (controlled transition from liquid shaping to solid structure formation).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and enhances light-emitting efficiency by allowing for adjustable light-projecting angles without the need for new molds, improving the flexibility and efficiency of LED lamp production.
Implementation Method 1
naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame
Implementation Method 2
placing a plurality of light-emitting chips on the substrate body, wherein the light-emitting chips are electrically connected to the substrate body
Implementation Method 3
semidrying surrounding light-reflecting frame
Implementation Method 4
forming a package colloid body on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body
Data Source
AI summary
A method of manufacturing a multichip package structure includes providing a substrate body; placing a plurality of light-emitting chips on the substrate body, the light-emitting chips being electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame having a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, the semidrying surrounding light-reflecting frame contacting and surrounding the package colloid body.