Semidrying Light-Reflecting Frame for LED Multichip Packages
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Solution Overview
Problem
The existing methods for manufacturing LED lamp multichip packages are costly due to the need for frame molds, which incur high expenses and require mold changes when the shape of the white frame is altered, limiting flexibility in design and production.
Innovation Solution
A method of manufacturing a multichip package structure that forms a semidrying surrounding light-reflecting frame without using any frame mold, by naturally drying a surrounding liquid colloid on a substrate body to create a non-drying colloid body with a dried outer layer, which then surrounds and solidifies to form a dried light-reflecting frame, allowing for the placement and coverage of light-emitting chips with a package colloid body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a white frame is manufactured by a predetermined frame mold, then the light-emitting efficiency is improved, but the manufacturing cost is increased
Solution Approach 1:
The patent extracts the frame structure from the traditional mold-based manufacturing process. Instead of using a frame mold to create the white frame, the invention uses a light-reflecting sheet material that is directly attached to the light-emitting module, eliminating the need for separate frame mold manufacturing while maintaining the light-reflecting function.
Solution Approach 2:
The patent replaces the expensive and durable frame mold with a cost-effective light-reflecting sheet material. This sheet material serves the same light-reflecting function but is much cheaper to produce and allows for easier design changes without requiring new mold investments.
2Adaptability or versatility
If the shape of the white frame is changed, then the design flexibility is improved, but the frame mold needs to be changed, thus the manufacturing complexity is increased
Solution Approach 1:
The patent removes the frame mold from the manufacturing process entirely. By using a light-reflecting sheet material that can be directly cut and shaped, the invention eliminates the complexity of mold changes when design modifications are needed.
Solution Approach 2:
The patent introduces dynamic design flexibility by using a light-reflecting sheet material that can be easily cut, shaped, and attached in various configurations. This allows the frame shape to be dynamically adjusted for different designs without requiring physical mold changes, unlike the static nature of traditional frame molds.
3Adaptability or versatility
If a new white frame is created for a new product, then the product variety is improved, but a new frame mold needs to be developed, thus the development time is increased
Solution Approach 1:
The patent replaces the time-consuming frame mold development process with a quick-cut light-reflecting sheet material approach. Each new product design can be rapidly prototyped by simply cutting the sheet material to the desired shape and attaching it, eliminating the lengthy mold development cycle.
Solution Approach 2:
The patent prepares light-reflecting sheet material in advance that can be quickly cut and shaped for different products. This preliminary preparation of versatile sheet material allows for rapid product development without the need for time-consuming mold creation for each new design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and allows for design flexibility by eliminating the need for frame molds, enhancing light-emitting efficiency and light-projecting angle through the formation of a semidrying surrounding light-reflecting frame that can be adjusted in shape and position, thereby improving the overall performance of the LED lamp.
Implementation Method 1
naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame
Implementation Method 2
solidifying the semidrying surrounding light-reflecting frame by natural drying at the predetermined room temperature or curing at a predetermined curing temperature to form a dried surrounding light-reflecting frame
Data Source
AI summary
A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried colloid outer layer totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.