Sending Chip Common Module Analog Front End Modules

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Solution Overview

Problem

The existing camera systems in self-driving vehicles require multiple chips to connect to multiple high-performance computing platforms, leading to increased volume and power consumption, limited heat dissipation, and signal attenuation issues.

Innovation Solution

A sending chip with a common module and multiple analog front end modules is used to transmit data to multiple receiving chips, reducing the number of chips needed and implementing one-to-multiple data transmission, synchronized transmission clocks, and coordinated control parameters to minimize power consumption and volume.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple chips are used to connect to multiple HCP devices, then data transmission capability is improved, but device volume and power consumption increase

Engineering Contradiction:
Improvedata transmission capabilityVSAvoiddevice volume
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The patent merges multiple transmitting apparatus functions into a single chip by integrating a common module that shares digital signal processing capabilities across multiple analog front end modules. This consolidation reduces the number of separate chips needed while maintaining the ability to transmit data to multiple HCP devices simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The common module is designed with universal functionality to serve multiple analog front end modules and multiple HCP devices. It can dynamically allocate resources and process signals for different receiving devices through a single transmitting apparatus, eliminating the need for dedicated chips for each connection.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If multiple chips are used to connect to multiple HCP devices, then data transmission capability is improved, but power consumption increases

Engineering Contradiction:
Improvedata transmission capabilityVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent merges multiple transmitting apparatus functions into a single chip by integrating a common module that shares digital signal processing capabilities across multiple analog front end modules. This consolidation reduces the number of separate chips needed while maintaining the ability to transmit data to multiple HCP devices simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The common module is designed with universal functionality to serve multiple analog front end modules and multiple HCP devices. It can dynamically allocate resources and process signals for different receiving devices through a single transmitting apparatus, eliminating the need for dedicated chips for each connection.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If multiple chips are used in the camera, then connection capability to multiple HCP devices is improved, but heat dissipation becomes limited

Engineering Contradiction:
Improveconnection capabilityVSAvoidheat dissipation
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent merges multiple transmitting apparatus functions into a single chip by integrating a common module that shares digital signal processing capabilities across multiple analog front end modules. This consolidation reduces the number of separate chips needed while maintaining the ability to transmit data to multiple HCP devices simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

4Volume of moving object

If a single chip is used to transmit to multiple devices, then device volume is reduced, but signal attenuation issues occur

Engineering Contradiction:
Improvedevice volumeVSAvoidsignal quality
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent segments the transmitting apparatus into a common module and multiple independent analog front end modules. Each analog front end module handles signal transmission to a specific HCP device, ensuring signal quality is maintained while the common module provides shared processing capabilities to reduce overall chip count.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP4274214B1Sending apparatus, data transmission system, and data transmission method
Publication Date: 2026.03.11 YINWANG INTELLIGENT TECHNOLOGIES CO LTD
  • EP4274214B1 patent drawingFigure 1~2
  • EP4274214B1 patent drawingFigure 3
  • EP4274214B1 patent drawingFigure 4

AI summary

This application provides a transmitting apparatus, a data transmission system, and a data transmission method. A common module and a plurality of analog front end AFE modules are included. The common module is configured to: receive first information, process the first information to obtain second information, and send the second information to at least two of the plurality of analog front end modules separately; and the analog front end module is configured to: process the second information to obtain third information, and send the third information. When a data transmission device is connected to a plurality of receiving apparatuses, only one transmitting apparatus needs to be set. Compared with a solution of disposing a plurality of chips, in this application, space occupied by a chip in the data transmission device can be reduced, and power consumption of the transmitting apparatus can be reduced.