Sensing Chip ESD Protection via Molded Body and Conductive Structure
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Solution Overview
Problem
Conventional semiconductor chips face damage from electrostatic discharge during testing, especially in the contact mode, due to the proximity of the electroconductive metal layer to the integrated circuit, and existing solutions like metal housings are labor-intensive and costly.
Innovation Solution
An information sensing device with a substrate, an information sensing chip, and an electroconductive structure, where the chip is partially surrounded by a molded body and an electroconductive structure, allowing for exposure of the chip surface while grounding electrostatic charges through the structure, reducing manufacturing costs and enabling automatic production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electroconductive metal layer is formed on the chip surface to conduct electrostatic charge, then electrostatic discharge protection is improved, but the integrated circuit may be damaged due to electromagnetic wave latch-up
Solution Approach 1:
The patent introduces a molded body as an intermediary material between the electroconductive metal layer and the external environment. This molded body has intermediate electrostatic discharge characteristics - not fully conductive like metal but not fully insulating like conventional plastics. It allows controlled electrostatic charge dissipation while blocking harmful electromagnetic waves from reaching the integrated circuit, thus resolving the contradiction between ESD protection and electromagnetic wave damage prevention.
2Reliability
If a metal housing is provided to cover the package body for electrostatic charge grounding, then electrostatic discharge protection is improved, but manufacturing cost and assembly time are increased
Solution Approach 1:
The patent merges the protective housing function and the electrostatic discharge protection function into a single molded body component. Instead of using a separate metal housing as in conventional solutions, the molded body is designed to perform both mechanical protection and electrostatic charge management simultaneously. This integration eliminates the need for separate metal housing components and assembly steps, thereby reducing manufacturing cost and assembly time while maintaining ESD protection.
Solution Approach 2:
The patent changes the electrostatic parameters of the housing material from conventional fully insulating plastics to specially formulated molded bodies with controlled electrostatic characteristics. By adjusting the material composition and electrostatic parameters, the molded body achieves optimal balance between electrostatic charge dissipation and electromagnetic wave blocking, providing ESD protection without requiring metal housing.
3Adaptability or versatility
If the chip surface is exposed to sense information, then sensing function is improved, but the chip surface is vulnerable to electrostatic discharge damage
Solution Approach 1:
The molded body serves as an intermediary protective layer that allows the chip surface to remain exposed for sensing while providing electrostatic discharge protection. The controlled electrostatic characteristics of the molded body enable it to dissipate static charges before they reach the exposed chip surface, thus maintaining both sensing functionality and chip durability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the chip from electrostatic discharge damage while reducing manufacturing costs and enabling efficient automatic production, enhancing the product's competitiveness.
Implementation Method 1
the electroconductive structure, where the chip is partially surrounded by a molded body and an electroconductive structure, allowing for exposure of the chip surface while grounding electrostatic charges through the structure
Data Source
AI summary
An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically connected to the electrical output portion and has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object. The electroconductive structure is electrically connected to the electrical output portion. The molded body is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface and a first surface of the electroconductive structure. The top chip surface is disposed opposite the bottom chip surface. The top chip surface and the first surface are exposed outside and disposed on substantially the same plane.