Sensing Decal Manufacturing via Segmented Roll-to-Roll Transfer
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Solution Overview
Problem
Current printing processes for electronic devices, such as sensors, require multiple passes and are prone to defects, leading to low yields and limited design flexibility due to the dependency of each layer on the preceding layer's topology, resulting in entire substrates being scrapped if a single defect occurs.
Innovation Solution
A method involving a flexible release layer with a non-uniform surface for printing conductive ink layers, followed by an adhesive layer, allowing for roll-to-roll processing and enabling the creation of patterned sensing decals that can be applied to devices without direct printing, enhancing flexibility and reducing waste by allowing for separate fabrication and quality control of individual decals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple conductive layers are printed directly onto a substrate to create a sensor, then the sensor can be manufactured with integrated layers, but if a single defect occurs on any layer, the entire substrate must be scrapped, leading to low manufacturing yield
Solution Approach 1:
The patent divides the sensor manufacturing process into separate decal units, each containing complete sensor layers on individual flexible substrates. These decals are printed and cured independently, then transferred to the final substrate. This segmentation allows defective decals to be discarded without wasting the entire substrate, thereby improving manufacturing yield while maintaining integrated layer structure.
Solution Approach 2:
The patent performs preliminary printing and curing of conductive layers on flexible decal substrates before final assembly. By completing the layer structure in advance on removable decals, the process allows for quality inspection and defect isolation before permanent substrate attachment, preventing entire substrate scrapping and improving overall productivity.
2Ease of manufacture
If multiple layers of material are printed on top of each other on a single substrate to create a sensor, then the sensor structure can be integrated, but the design flexibility is limited because each layer is dependent on the topology of the preceding layer
Solution Approach 1:
The patent segments the sensor into multiple independent decal components, each with its own flexible substrate and conductive layers. This segmentation allows each decal to be designed and manufactured independently with optimal topology for its specific function, then assembled into the final integrated sensor, thereby achieving both integration and design flexibility.
Solution Approach 2:
The patent introduces the dimension of modular assembly by transferring pre-fabricated decals from their manufacturing substrate to the final device substrate. This dimensional transition allows complex multi-layer structures to be built through stacking independent units rather than sequential printing, enabling greater design freedom and adaptability.
Data Source
AI summary
A sensing decal (400) for use in the production of a sensor, includes a flexible release layer (401), a conductive ink layer (402) and an adhesive layer (403). The conductive ink layer is printed onto a first surface (404) of the flexible release layer and the adhesive layer is printed onto the conductive ink layer. The first surface includes a substantially non-uniform surface (405) and the conductive ink layer includes at least one patterned element (503-509) providing a predetermined set of electrical properties for formation of a sensor.