Sensing Device Temperature Compensation via Heating Arrangement
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Solution Overview
Problem
Temperature fluctuations affect the electrical characteristics of sensing devices, leading to reduced calibration effectiveness after mounting to an electronics substrate, as existing solutions do not account for stresses introduced during mounting.
Innovation Solution
A sensing device with a heating arrangement on a semiconductor substrate that is activated to calibrate for temperature fluctuations, using a control system to determine temperature coefficients and store trim codes for temperature compensation, ensuring accurate measurements by adjusting for temperature variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If calibration is performed at final test, then measurement accuracy is improved, but calibration effectiveness deteriorates after mounting due to thermal and mechanical stresses
Solution Approach 1:
The patent applies preliminary action by performing calibration at final test before mounting, when the sensor is in a stress-free state. This establishes baseline calibration data that can be used to compensate for stresses introduced during subsequent mounting processes. The calibration is performed preliminarily on the bare die before it undergoes thermal and mechanical stresses of assembly.
Solution Approach 2:
The patent utilizes parameter changes by measuring sensor output at multiple known temperatures during calibration to determine temperature coefficients. These coefficients are then used to compensate for temperature-induced parameter changes during operation. The system changes temperature parameters systematically to characterize and compensate for thermal effects.
2Adaptability or versatility
If sensor is mounted to electronics substrate, then device integration is improved, but measurement accuracy deteriorates due to thermal and mechanical stresses
Solution Approach 1:
The patent replaces mechanical stress compensation with an electrical/software-based solution. Instead of trying to mechanically isolate or protect the sensor from mounting stresses, the system uses electrical calibration data and digital compensation algorithms to account for the effects of thermal and mechanical stresses introduced during substrate mounting.
Solution Approach 2:
The patent creates a virtual model or copy of the sensor's stress-free characteristics through calibration measurements. By capturing the sensor's output characteristics in a known, stress-free state and storing these as reference data, the system can compare actual post-mounting measurements against this copied baseline to detect and compensate for stress-induced deviations.
3Measurement precision
If heating arrangement is activated continuously, then temperature compensation is improved, but energy consumption increases
Solution Approach 1:
The patent applies periodic action by activating the heating arrangement in discrete temperature steps during calibration rather than continuously. The heater is turned on for specific durations to reach target temperatures, then turned off for measurements, creating a periodic heating cycle that efficiently covers the temperature range while minimizing total energy consumption.
Solution Approach 2:
The patent uses skipping by rapidly transitioning through temperature steps during calibration rather than maintaining continuous heating. The system rushes through the calibration temperature range by applying heat only when needed to reach the next measurement point, then immediately stopping heating during measurements to minimize energy waste while still obtaining the necessary calibration data.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides temperature-compensated measurements by actively addressing temperature-induced performance variations in sensing devices, enhancing measurement accuracy and reliability post-mounting.
Implementation Method 1
a heating arrangement 114 provided on a semiconductor substrate 120
Data Source
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AI summary
Apparatus, systems, and methods are provided for sensing devices. An exemplary sensing device (102) includes a sensing arrangement on a substrate to sense a first property, a heating arrangement (114), and a control system (116) coupled to the first sensing arrangement and the heating arrangement (114) to activate the heating arrangement (114) to heat the first sensing arrangement and deactivate the heating arrangement (114) while obtaining one or more measurement values for the first property from the first sensing arrangement.