Sensing Device Volume Reduction via Opposite Surface Mounting
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Solution Overview
Problem
The existing sensing devices in smart hearing aids are too large due to the size of the sensing elements, which poses a challenge in miniaturization and increased manufacturing costs.
Innovation Solution
A sensing device design that includes a lead frame with opposing surfaces for chip and sensor placement, an insulated housing, and a protector, allowing for reduced volume by separating the chip and sensor on different surfaces, thereby minimizing overall size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the sensing device uses conventional packaging with chip and sensor on the same surface, then the manufacturing process is simpler, but the volume of the sensing device becomes too large
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional layout (chip and sensor on the same surface) to a three-dimensional arrangement (chip on first surface, sensor on second opposite surface of lead frame). This vertical stacking approach reduces the footprint area and overall volume of the sensing device while maintaining all necessary functional components.
Solution Approach 2:
The patent implements nesting by placing the sensor on the second surface of the lead frame, which is opposite to the first surface where the chip is mounted. The insulated housing then covers both surfaces, creating a nested configuration where components are arranged in layers within the same device envelope, effectively reducing the external dimensions.
2Volume of moving object
If the sensing device is miniaturized, then the hearing aid device size is reduced, but the manufacturing cost increases
Solution Approach 1:
The patent applies segmentation by dividing the lead frame into distinct functional surfaces: the first surface for chip mounting and the second opposite surface for sensor mounting. This segmentation allows for optimized placement of each component on its designated surface, reducing overall device volume while maintaining manufacturability through standardized assembly processes.
3Adaptability or versatility
If multiple components are installed in miniaturized hearing aid devices, then the functionality increases, but the available space becomes insufficient
Solution Approach 1:
The patent resolves the space constraint by utilizing the third dimension (vertical depth) of the lead frame structure. By mounting the chip on the first surface and the sensor on the second opposite surface, the design effectively doubles the component capacity within the same footprint area, enabling enhanced functionality in miniaturized hearing aid devices without increasing the lateral dimensions.
Data Source
AI summary
A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.