Sensing Device Package Structure Embedding in Dielectric Layers
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Solution Overview
Problem
Conventional methods for fabricating sensing device package structures result in thicker products due to labor-intensive processes, making it difficult to achieve a thin and compact design as electronic products trend towards being lighter and thinner.
Innovation Solution
The method involves embedding the sensing device within a middle dielectric layer, using a blocking pattern to protect the sensing region during fabrication, and employing a laser to carefully remove layers to avoid damage, thereby reducing the overall thickness and volume of the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional packaging methods are used to fabricate sensing device package structures, then the sensing device can be packaged on the circuit board, but the overall thickness of the package structure becomes too thick and the fabrication process requires more labor and time
Solution Approach 1:
The patent merges the sensing device packaging process with the circuit board fabrication process into a single integrated workflow. The sensing device is embedded within the circuit board structure during fabrication rather than being packaged separately afterward, combining what were previously distinct operations into one unified manufacturing process.
Solution Approach 2:
The sensing device is embedded into the circuit board at an early stage of fabrication, before final assembly and packaging operations. This preliminary embedding action eliminates the need for subsequent separate packaging steps, reducing both thickness and manufacturing complexity.
2Volume of moving object
If the sensing device is packaged separately on the circuit board, then the sensing device can be protected, but the overall volume of the package structure increases
Solution Approach 1:
The sensing device is nested within the circuit board structure itself, with the device embedded in recesses or cavities of the board. This nesting approach allows the sensing device to be housed within the existing package volume rather than adding external packaging layers, maintaining protection while minimizing volume increase.
3Productivity
If conventional separate fabrication methods are used, then the sensing device and circuit board can be manufactured independently, but the production yield decreases due to potential damage to the sensing region
Solution Approach 1:
The sensing device is embedded into the circuit board during the fabrication process itself, before subsequent processing steps that might cause damage. This preliminary embedding protects the sensing region from mechanical stress and damage that would occur in separate handling and packaging operations.
Solution Approach 2:
By combining the sensing device fabrication with the circuit board fabrication into a single integrated process, the patent eliminates multiple handling, transfer, and assembly steps that increase the risk of damage. The unified process reduces production yield loss while managing fabrication complexity through integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of sensing device package structures with a thin overall thickness and small volume, improving production yield by minimizing damage to the sensing region and streamlining the fabrication process.
Implementation Method 1
employing a laser to carefully remove layers to avoid damage
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
A sensing device package structure including a middle dielectric layer (120), a sensing device (130), a front dielectric layer (150), a front patterned conductive layer (170) and at least one front conductive via (180A) is provided. The middle dielectric layer (120) has an anterior surface (120c), a posterior surface (120b) and a middle opening (120a). The sensing device (130) is disposed in the middle opening (120a). The sensing device (130) has a front surface (130a), a back surface (130b), a sensing region (130c), a blocking pattern (132), and at least one electrode (134). The front dielectric layer (150) is disposed on the anterior surface (120c) of the middle dielectric layer (120) and the front surface (130a) of the sensing device (130). The front dielectric layer (150) has a front opening (150a) exposed the sensing region (130c) and the blocking pattern (132). The front patterned conductive layer (170) is disposed on the front dielectric layer (150). The front conductive via (180A) penetrates through the front dielectric layer (150) and connects the front patterned conductive layer (170) and the electrode (134).