Sensing Module Without Transparent Encapsulation

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Solution Overview

Problem

Conventional image sensing modules incur high production costs due to the use of expensive transparent encapsulation, which also reduces light intensity and efficiency by covering the laser diode.

Innovation Solution

The sensing module assembles chips directly on a substrate without the need for transparent encapsulation, using a carrier, substrate, and conductive materials to connect components, allowing for direct light transmission and reducing assembly complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If transparent encapsulation is used to package the laser diode and Zener diode, then the components are protected from damage and contact failure, but the production cost increases and light intensity is reduced

Engineering Contradiction:

Improveprotection from damage and contact failureVSAvoidproduction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes the transparent encapsulation component entirely from the module design. The laser diode and Zener diode are mounted directly on the circuit board without encapsulation, eliminating the cost and light attenuation associated with this component while maintaining reliability through direct mounting and protective conformal coating.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the bulky transparent encapsulation with a thin conformal coating applied directly to the circuit board. This thin film provides protection against damage and contact failure while having minimal impact on light transmission and incurring lower cost.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If transparent encapsulation is used to package the laser diode, then the components are protected, but the light utilization efficiency is reduced due to light absorption by the encapsulation

Engineering Contradiction:

Improvecomponent protectionVSAvoidlight utilization efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The transparent encapsulation is completely removed from the design. The laser diode operates without encapsulation, eliminating light absorption losses entirely while reliability is maintained through direct mounting on the circuit board and protective conformal coating.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The thick transparent encapsulation is replaced with a thin conformal coating that provides necessary protection while allowing maximum light transmission. This thin film minimizes light absorption and maintains high light utilization efficiency.

Inventive Principle:

Principle #30Flexible shells and thin films

3Ease of operation

If transparent encapsulation is used to modularize the laser diode, Zener diode and connection terminals, then the assembling step is simplified, but the production cost increases

Engineering Contradiction:

Improveassembling stepVSAvoidproduction cost

Core Design Contradiction:

Ease of operationVSEase of manufacture

Solution Approach 1:

The laser diode, Zener diode, connection terminals, and circuit board are merged into a single integrated structure. All components are mounted directly on the circuit board, eliminating the need for separate encapsulation as a modularizing element and reducing overall production cost.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The expensive transparent encapsulation is replaced with a thin conformal coating that provides protection and modularization at lower cost. This thin film maintains the simplified assembly process while reducing material costs.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach lowers production costs and enhances light utilization efficiency by eliminating the need for expensive encapsulation and minimizing light absorption.

Implementation Method 1

the substrate is electrically connected to the carrier through the conductive materials

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the light-emitting chip is a light-emitting diode or a laser diode

Methodology Applied

Scientific EffectLight emission: Light Emitting Diode

Implementation Method 3

a sensing module having a plurality of chips... an image sensor 120

Methodology Applied

Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS8110837B2Sensing module

Publication Date: 2012.02.07 MICROSOFT TECHNOLOGY LICENSING LLC

AI summary

A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically connected to the carrier respectively. The chips are disposed on the substrate and are electrically connected to the substrate respectively. The production cost of the sensing module is low.