Sensing Module Substrate With Penetrating Vias For Fingerprint Sensors
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Solution Overview
Problem
Current fingerprint recognition sensors face challenges in achieving high reliability and sensitivity, particularly in terms of size and accuracy, due to limitations in their design and materials used for substrates and interconnections.
Innovation Solution
A sensing module substrate with sensing vias penetrating through a film substrate, coupled to a semiconductor chip with pixels, and an interconnection pattern on the substrate surfaces, along with a glass layer and bezel configuration, enhances sensitivity and accuracy by reducing the distance between sensing elements and touch events, allowing for improved information transmission and module miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional packaging substrates and bonding wires are used to connect sensing elements, then the module size increases and sensitivity decreases, but if sensing vias are directly coupled to semiconductor chip pixels, then the distance between sensing elements and touch events is reduced, improving sensitivity and accuracy
Solution Approach 1:
The patent removes traditional packaging substrates and bonding wires from the sensing module structure. By directly coupling sensing vias to semiconductor chip pixels, the unnecessary intermediate components are extracted, reducing module size and improving sensitivity simultaneously.
Solution Approach 2:
The sensing vias are directly integrated with the semiconductor chip pixels, merging the sensing element connection function into the chip structure itself. This eliminates separate packaging layers and bonding wire connections, achieving both miniaturization and enhanced sensitivity.
2Reliability
If additional packaging substrates and bonding wires are used for connection, then manufacturing reliability may improve through standardized processes, but the module size increases and sensitivity decreases
Solution Approach 1:
The patent extracts and eliminates packaging substrates and bonding wires from the sensing module. This direct coupling approach reduces the number of components and interfaces, thereby reducing module size while maintaining manufacturing reliability through simplified assembly processes.
3Measurement precision
If the distance between sensing elements and touch events is reduced, then sensitivity and accuracy improve, but the substrate structure becomes more complex
Solution Approach 1:
The sensing vias are merged directly with the semiconductor chip pixels, eliminating intermediate packaging layers. This integration achieves minimal distance between sensing elements and touch events, improving accuracy while the unified structure actually simplifies the overall substrate configuration.
Data Source
AI summary
A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.