Sensing Panel Bridge Structure for Low-Interference Displays
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Solution Overview
Problem
Display devices face challenges in increasing visibility and light emission efficiency due to interference between the optical path of the display device and the conductive structure of the sensing panel.
Innovation Solution
A sensing panel design featuring a first insulating layer with a sensor base layer, a first conductive pattern layer with a bridge, a second insulating layer, and a second conductive pattern layer with a valley bridge, where the second conductive pattern layer is in direct contact with the upper surface of the first insulating layer, and a passivation layer covers the second conductive pattern layer, enhancing visibility and light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive structure is added to the sensing panel, then sensing function is improved, but optical interference increases and visibility deteriorates
Solution Approach 1:
The patent introduces a multi-layer vertical structure with conductive patterns distributed across different planes (first conductive pattern layer, second conductive pattern layer, third conductive pattern layer). This three-dimensional arrangement reduces in-plane optical interference while maintaining sensing functionality through vertical stacking, effectively moving the solution from a two-dimensional to three-dimensional space.
Solution Approach 2:
Insulating layers are introduced as intermediary elements between conductive pattern layers. These insulating layers electrically isolate adjacent conductive patterns while being optically transparent, thereby preventing electrical interference without compromising visibility. The insulating layers act as mediators that allow conductive structures to coexist with optical requirements.
2Measurement precision
If conductive pattern layers are stacked to improve sensing, then sensing precision is improved, but structural complexity increases
Solution Approach 1:
The sensing panel is segmented into multiple functional layers, each with specific conductive patterns optimized for particular sensing tasks. The first, second, and third conductive pattern layers can be independently designed and configured, allowing complex sensing functions to be divided into simpler, manageable segments that reduce overall structural complexity while maintaining high sensing precision.
Solution Approach 2:
The multi-layer conductive pattern structure serves multiple functions simultaneously: the first conductive pattern layer provides primary sensing, the second layer enhances precision, the third layer offers additional sensing capability, and insulating layers provide both electrical isolation and structural support. This multi-functionality reduces the need for separate components, thereby managing complexity.
3Reliability
If bridge structures are added to connect conductive patterns, then electrical connectivity is improved, but optical obstruction increases
Solution Approach 1:
The bridge structures are designed as thin film conductive patterns that maintain electrical connectivity while minimizing optical obstruction. These thin film bridges allow light to pass through with reduced interference compared to thick rigid conductors, effectively balancing electrical connectivity requirements with optical performance.
Solution Approach 2:
The bridge structures are strategically positioned and dimensioned to provide electrical connectivity only where necessary, rather than uniformly across the entire panel. By concentrating conductive material in localized bridge regions and using transparent or thin materials in these specific locations, the design achieves required connectivity while minimizing overall optical obstruction.
Data Source
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AI summary
A sensing panel includes a first insulating layer comprising a sensor base layer. A first conductive pattern layer is disposed on the sensor base layer and includes a bridge in an area connected to a contact portion. A second insulating layer is disposed on the first conductive pattern layer. A second conductive pattern layer is connected to the first conductive pattern layer in the contact portion and includes a valley bridge in an area where the second insulating layer is removed. A passivation layer covers the second conductive pattern layer.