Sensing Structure With Variable Line Width Connecting Circuit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Sensing panels face disconnection issues due to the transition from finer conductive lines of sensing electrodes to thicker peripheral circuit lines, leading to decreased qualified rates and sensing abilities.
Innovation Solution
The sensing structure incorporates a connecting pattern with progressively changing line widths or mesh densities, ensuring a greater line width or mesh density at the periphery circuit connection than at the sensing unit connection, and includes multiple conductive lines between the sensing unit and periphery circuit to prevent disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If finer conductive lines are used for sensing electrodes to improve transmittance and visual effect, then the transmittance and visual effect are improved, but disconnection easily occurs in transition areas where lines change from finer to thicker, reducing qualified rate and sensing ability
Solution Approach 1:
The connecting circuit employs different line widths in different regions: finer lines near the sensing unit for maintaining transmittance, and thicker lines near the periphery circuit for ensuring connection reliability. This local variation in line quality resolves the contradiction between transmittance and connection reliability.
Solution Approach 2:
The connecting circuit acts as an intermediary between the finer sensing electrode lines and the thicker periphery circuit lines. It provides a transition zone with progressively changing line widths that bridges the two different line thickness regimes, preventing disconnection while maintaining transmittance.
2Power
If thicker conductive lines are used for periphery circuit to improve conductivity, then the conductivity is improved, but disconnection easily occurs in transition areas where lines are changed from finer ones to thicker ones, making qualified rate decrease
Solution Approach 1:
The connecting circuit uses locally optimized line widths: thicker lines where high conductivity is needed (near periphery circuit) and finer lines where transmittance is critical (near sensing unit). This local differentiation achieves both high conductivity and high manufacturing precision/qualified rate.
Solution Approach 2:
The connecting circuit features dynamically varying line widths that adapt to different functional requirements at different positions. The line width transitions from finer to thicker in a controlled manner, allowing the structure to accommodate both transmittance and conductivity requirements while maintaining manufacturing precision.
3Ease of manufacture
If uniform line width is used throughout the connecting pattern, then manufacturing is simpler, but disconnection occurs when lines transition from thicker to finer, reducing sensing ability
Solution Approach 1:
Rather than using uniform line width, the connecting circuit implements local quality variation with different line widths in different regions. This approach slightly increases manufacturing complexity but dramatically improves reliability and sensing ability by preventing disconnection in transition areas.
Solution Approach 2:
The connecting circuit is segmented into multiple zones with different line widths: a first region with finer lines connected to the sensing unit, and a second region with thicker lines connected to the periphery circuit. This segmentation allows each zone to be optimized for its specific function while maintaining overall system performance.
Data Source
AI summary
A sensing structure includes a sensing unit, a periphery circuit, and a connecting circuit. The connecting circuit connecting the sensing unit and the periphery circuit includes a connecting pattern. In an embodiment, the connecting pattern has at least two line widths. The line width of a part of the connecting pattern connecting the periphery circuit is greater than the line width of a part of the connecting pattern connecting the sensing unit. In an embodiment, the connecting pattern includes a mesh pattern having at least two mesh densities. The mesh density of a part of the mesh pattern connecting the periphery circuit is greater than the mesh density of a part of the mesh pattern connecting the sensing unit. In an embodiment, the connecting circuit includes lines between and connecting a single sensing series of the sensing unit and a periphery wire of the periphery circuit.