Semiconductor Sensor Adhesive Thermal Hysteresis
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Solution Overview
Problem
Semiconductor pressure sensors face challenges in improving detection accuracy due to uneven distribution of microbeads in the adhesive, leading to a curved temperature property line that cannot be effectively corrected by electronic circuits.
Innovation Solution
A semiconductor physical quantity sensor is developed with a sensor chip bonded to a support member using an adhesive mixture of cross-linked resin and fluorosilicone rubber, which includes solid or hollow spherical particles, reducing the curve of the temperature property line and enhancing detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If microbeads are added to the adhesive to reduce thermal hysteresis, then thermal hysteresis is reduced, but the microbeads become unevenly distributed causing the temperature property line to curve
Solution Approach 1:
The patent uses a composite adhesive material consisting of a resin base material combined with granular cross-linked resin particles. This composite structure allows the adhesive to maintain both the thermal hysteresis reduction benefit of microbeads and the uniform distribution properties of the resin matrix, eliminating the curvature in the temperature property line while preserving thermal performance
Solution Approach 2:
The patent changes the physical and chemical parameters of the adhesive by using cross-linked resin granules with specific size ranges (0.1-10 μm) and controlling the cross-linking degree. This parameter optimization ensures uniform distribution throughout the adhesive while maintaining effective thermal hysteresis compensation, resolving the contradiction between thermal performance and temperature property linearity
2Measurement precision
If electronic circuits are used to correct the curved temperature property line, then detection accuracy may be improved, but the device complexity increases
Solution Approach 1:
The patent replaces the need for complex electronic correction circuits with a materially-based solution. By incorporating granular cross-linked resin into the adhesive, the temperature property line curvature is prevented at the material level rather than requiring electronic compensation, thus maintaining high detection accuracy while minimizing device complexity
Solution Approach 2:
The patent converts the potential harm of temperature-induced curvature into a benefit by using the thermal expansion characteristics of cross-linked resin granules to actively compensate for thermal hysteresis. This transforms what would normally be a source of error into a mechanism that improves temperature property linearity without requiring additional electronic correction systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of this adhesive mixture effectively reduces temperature nonlinearity and thermal hysteresis, thereby improving the detection accuracy of the sensor by minimizing the curve of the temperature property line.
Implementation Method 1
The adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin
Data Source
AI summary
A semiconductor physical quantity sensor includes a sensor chip, a support member for fixing the sensor chip to a fixing position and an adhesive bonding the sensor chip with the support member. The sensor chip includes a semiconductor substrate and a chip base supporting the semiconductor substrate. The semiconductor substrate is provided with a sensing portion for detecting a physical quantity. The chip base is bonded with the support member through the adhesive. The adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin.