Sensor Assembly Adhesive Cushioning for Rotational Speed Measurement
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Solution Overview
Problem
Conventional sensor assemblies for rotational speed and position measurement face issues with semiconductor sensor element breakage due to forces exerted by enveloping materials like epoxy resin, which can cause displacement and deformation, especially during the application and curing process.
Innovation Solution
The use of an adhesive introduced into a receiving space between the mounting surface and the semiconductor sensor element's bottom side fixes and supports the sensor element, preventing slipping, deformation, and thermomechanical stress, while an enveloping material covers the sensor element completely.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the housed semiconductor sensor element is covered by a cured enveloping material, then the sensor element is protected, but forces act on the sensor element from all sides causing displacement and breakage
Solution Approach 1:
A receiving space is created between the mounting surface and the bottom side of the semiconductor sensor element, which is filled with an adhesive that acts as a cushioning layer. This adhesive layer absorbs and distributes the forces exerted by the enveloping material during curing, preventing direct transmission of stress to the fragile sensor element and thereby preventing breakage while maintaining protection.
2Reliability
If the housed semiconductor sensor element is covered by a cured enveloping material, then the sensor element is protected, but the sensor element may be displaced during application and curing
Solution Approach 1:
The adhesive in the receiving space serves as a cushioning and stabilizing layer that prevents displacement of the sensor element during enveloping material application and curing. The adhesive bonds the sensor element to the mounting surface while accommodating volume changes, ensuring position stability throughout the process.
Solution Approach 2:
The adhesive acts as an intermediary substance between the rigid mounting surface and the sensor element. It mediates the interaction forces during enveloping material curing, allowing the sensor element to remain stable and properly positioned while still being protected by the enveloping material.
3Reliability
If the housed semiconductor sensor element is covered by a cured enveloping material, then the sensor element is protected, but thermomechanical stresses act on the sensor element during operation
Solution Approach 1:
The adhesive layer in the receiving space serves as a pre-established cushioning mechanism that absorbs thermomechanical stresses generated during sensor assembly operation. This cushioning layer prevents direct transmission of thermal and mechanical stresses to the sensor element, reducing stress accumulation and improving reliability under varying operating conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive ensures the semiconductor sensor element remains securely positioned and protected from breakage during material application and operation, effectively minimizing the risk of damage and deformation, and provides mechanical damping to absorb forces.
Implementation Method 1
the housed semiconductor sensor element is glued onto a mounting surface of the holder body using an adhesive that differs from the enveloping material, the adhesive being situated in a receiving space between the mounting surface and a bottom side of the semiconductor sensor element
Implementation Method 2
The adhesive introduced into the receiving space advantageously dampens thermomechanical stresses, which may act on the housed semiconductor sensor element in subsequent operation of the sensor assembly. The adhesive contained in the receiving space advantageously dampens thermomechanical stresses
Data Source
AI summary
A sensor assembly comprising a holder body and a housed semiconductor sensor element situated on the holder body for rotational speed measurement and/or position measurement, a cured enveloping material that covers the housed semiconductor sensor element completely being situated on the holder body. It is provided that the housed semiconductor sensor element is glued onto a mounting surface of the holder body using an adhesive that differs from the enveloping material, and that the adhesive is situated in a receiving space between the mounting surface and a bottom side of the housed semiconductor sensor element that is facing the mounting surface.