Force Torque Sensor Adhesive Modulus Optimization
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Solution Overview
Problem
Existing force torque sensor devices face issues with degraded sensor characteristics and reduced connection reliability due to the properties of the adhesive used to transmit displacement from the strain body to the sensor chip.
Innovation Solution
A force torque sensor device is designed with a sensor chip that detects displacements in predetermined axis directions, a strain body to transmit forces, and an adhesive with a Young's modulus between 130 MPa and 1.5 GPa to maintain connection reliability while suppressing sensor characteristic degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive with inappropriate Young's modulus is used, then connection reliability is improved, but sensor characteristics are degraded
Solution Approach 1:
The patent applies parameter changes by specifying a precise range for the Young's modulus of the adhesive (130 MPa to 1.5 GPa). This parameter optimization resolves the contradiction by identifying the optimal stiffness range that simultaneously ensures strong bonding (connection reliability) and maintains accurate displacement transmission (sensor characteristics). The specific modulus range balances the competing requirements of bond strength and measurement fidelity.
2Strength
If adhesive with high Young's modulus is used, then bond strength is improved, but displacement transmission accuracy is degraded
Solution Approach 1:
The patent resolves this contradiction through parameter changes by establishing an optimal Young's modulus range (130 MPa to 1.5 GPa) for the adhesive. This range is carefully selected to balance bond strength requirements with displacement transmission accuracy. Adhesives within this range provide sufficient bonding strength while maintaining the flexibility needed for accurate displacement transmission to the sensor chip.
3Measurement precision
If adhesive with low Young's modulus is used, then sensor sensitivity is maintained, but connection reliability is degraded
Solution Approach 1:
The patent applies parameter changes by defining a minimum Young's modulus threshold (130 MPa) for the adhesive. This lower bound ensures that the adhesive maintains sufficient bonding strength and connection reliability while still allowing the sensor chip to detect displacements with adequate sensitivity. The parameter range prevents the adhesive from being too soft, which would compromise connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains connection reliability and sensor performance by using an adhesive with a specific modulus range, ensuring high input displacement transmission rates and minimizing sensitivity and linearity degradation.
Implementation Method 1
The Young's modulus of the adhesive is greater than or equal to 130 MPa and less than or equal to 1.5 GPa
Data Source
AI summary
A force torque sensor device includes a sensor chip that detects a displacement in a predetermined axis direction, a strain body that transmits an applied force to the sensor chip, and an adhesive that bonds the sensor chip to the strain body. The Young's modulus of the adhesive is greater than or equal to 130 MPa and less than or equal to 1.5 GPa.