Physiological Sensor Adhesive Removal via Thermal Phase Transition
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Solution Overview
Problem
The reprocessing of physiological sensors, particularly pulse oximetry sensors, faces challenges in efficiently removing adhesives and disposable components without damaging reusable components, leading to increased costs and potential degradation in sensor performance.
Innovation Solution
Applying heat through mediums like aqueous solutions or heat guns to efficiently disassemble sensors, allowing for the removal of adhesives and disposable components, followed by reassembly with new components, testing, and sterilization to create a reprocessed sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional mechanical removal methods are used to remove adhesives and disposable components, then the removal process is simple, but the reusable sensor components are damaged and reprocessing costs increase
Solution Approach 1:
The patent changes the physical state of the adhesive from solid to liquid by heating it above its glass transition temperature, making it removable without damaging the sensor components. This parameter change (temperature) enables easy removal while preserving component integrity.
Solution Approach 2:
The patent utilizes the phase transition of the adhesive material from a rigid solid state to a softened liquid state through heating. This phase transition allows the adhesive to be removed cleanly from the sensor components without mechanical damage, resolving the contradiction between easy removal and component integrity.
2Productivity
If heat is applied to remove adhesives, then component removal becomes efficient, but energy consumption increases
Solution Approach 1:
The patent exploits the glass transition phase change of the adhesive material, which occurs at a relatively low temperature. This allows efficient removal through moderate heating rather than high-temperature processing, improving productivity while limiting energy consumption to what is needed for the phase transition only.
3Loss of time
If high temperature is used to remove adhesives quickly, then reprocessing time is reduced, but reusable components are damaged
Solution Approach 1:
The patent identifies and utilizes the specific glass transition temperature parameter of the adhesive material. By heating to this precise temperature threshold, the adhesive softens sufficiently for removal within a short time frame while avoiding temperatures that would damage the sensitive sensor components, thus balancing reprocessing time with component quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces material costs and extends the life of reusable sensor components, ensuring reliable performance while maintaining sterility and efficiency in the reprocessing process.
Implementation Method 1
applying heat to a physiological sensor so as to efficiently remove adhesives, adhesive layers, and/or other disposable components of the sensor
Implementation Method 2
Heat may be applied to the physiological sensor efficiently via a medium, such as an aqueous solution (for example, water)
Data Source
AI summary
Methods of reprocessing physiological sensors may include applying heat to a physiological sensor so as to efficiently remove adhesives, adhesive layers, and/or other disposable components of the sensor. Heat may be applied to the physiological sensor efficiently via a medium, such as an aqueous solution (for example, water). Reusable components of the physiological sensor may then be reassembled with new disposable components and/or adhesives to produce a reprocessed sensor. The methods may further include testing and/or replacement of various reusable sensor components, testing of the reprocessed sensor, cleaning of the reprocessed sensor and/or sensor components, and/or sterilization of the reprocessed sensor, among other steps.