Sensor Apparatus SoC Integration Using 1-Poly Technology
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Solution Overview
Problem
Existing sensor apparatuses for 3-D camera systems are too large and complex, lacking robustness for industrial applications and requiring extensive peripherals, which complicates their integration and increases costs.
Innovation Solution
A sensor apparatus integrated as a system-on-chip (SoC) using 1-poly technology, incorporating both analog and digital circuit components, including an analog/digital converter, non-volatile memory, and specialized modules for radiation detection and signal processing, allowing for compact, robust, and cost-effective integration into various sensor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If sensor apparatuses are designed with separate analog and digital components and peripherals, then functional capability is achieved, but device size and complexity increase
Solution Approach 1:
The patent integrates analog circuit components, digital circuit components, and peripheral functions into a single sensor chip. The analog/digital converter is integrated on the same chip, combining previously separate components. This merging reduces device complexity and size while maintaining functional capability and improving robustness through unified design.
2Volume of moving object
If sensor apparatuses are miniaturized, then integration into applications is improved, but robustness and necessary functionality are compromised
Solution Approach 1:
The patent achieves miniaturization by integrating all necessary components (analog circuits, digital circuits, A/D converter, and peripherals) onto a single sensor chip. This consolidation reduces the overall volume while maintaining full functionality and robustness, as all essential elements are present in the integrated structure rather than requiring separate discrete components.
3Area of stationary object
If analog and digital circuit components are integrated on the same chip, then space is saved, but manufacturing complexity increases
Solution Approach 1:
The patent integrates analog and digital circuit components on the same sensor chip using compatible manufacturing processes. The analog/digital converter is implemented using the same semiconductor fabrication technology as the rest of the chip, allowing standard manufacturing techniques to produce the integrated structure without requiring complex multi-step assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SoC solution enables efficient integration into diverse systems, enhancing robustness and reducing costs by integrating essential functions within a single chip, improving detection capabilities under varying conditions and ambient light, while minimizing space and energy consumption.
Implementation Method 1
One module of the analog circuit component is embodied as a sensor device for detecting electromagnetic radiation, in particular IR radiation
Data Source
AI summary
A sensor apparatus including at least one analog and one digital circuit component and an analog/digital converter for converting analog signals of the analog circuit component into digital signals for the digital circuit component, and vice versa, wherein the analog circuit component and the digital circuit components include at least one module for electronically implementing a function, and wherein one of the modules of the analog circuit component is embodied as a sensor device for detecting optical radiation and one of the modules of the digital circuit component is embodied as a signal processing device for processing digital signals. In order to enable improved integration into application-based sensor devices, the circuit components including the analog/digital converter are integrated as an integrated circuit in a chip and the chip is manufactured as a semiconductor structure using 1-poly technology.