Semiconductor Sensor Assembly With Opaque Barrier for Cross-Talk
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Solution Overview
Problem
Semiconductor sensor devices face challenges in miniaturization due to cross-talk issues between emitter and receiver components, limiting the achievable sensor size in wearable devices where space is extremely limited.
Innovation Solution
The solution involves overmolding a sensor assembly with an opaque compound, featuring a transparent glass structure and an emitter assembly arranged such that their top surfaces form a common plane, with an opaque body covering the remaining surface area to prevent cross-talk and protect the integrated circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the sensor device size is decreased to meet wearable device space requirements, then the device can be integrated into wearable gadgets, but cross-talk between emitter and receiver components increases
Solution Approach 1:
An opaque body is introduced as an intermediary component between the emitter assembly and the photosensitive element. This opaque body blocks stray light paths while allowing the top surfaces of the transparent structure and emitter assembly to form a common plane, thus preventing cross-talk even when components are arranged in close proximity for miniaturization
Solution Approach 2:
The top surfaces of the transparent structure, opaque body, and emitter assembly are arranged to form a common plane, creating a localized flat surface structure. This local planarity ensures that light emitted from the emitter travels through the transparent structure to reach the photosensitive element without being blocked, while the opaque body below blocks stray light paths
2Adaptability or versatility
If multiple sensors are integrated into limited wearable space, then device functionality is improved, but cross-talk issues become more severe
Solution Approach 1:
The sensor device is segmented into distinct functional components: a transparent structure covering the photosensitive element, an emitter assembly, and an opaque body. This segmentation allows each component to perform its specific function while the opaque body acts as a light barrier to prevent cross-talk between multiple sensors that may be integrated in the same device
Solution Approach 2:
The opaque body serves as a light-blocking intermediary that can be positioned between multiple emitter-receiver pairs in an integrated sensor system, preventing cross-talk while allowing the top surfaces to maintain a common plane for compact integration
3Length of moving object
If the emitter and receiver are arranged in close proximity to reduce device size, then miniaturization is achieved, but internal cross-talk increases
Solution Approach 1:
The local quality of the top surface is maintained as a common plane across the transparent structure, opaque body, and emitter assembly. This allows the emitter and receiver to be positioned close together (reducing device length) while the opaque body below creates localized light blocking to prevent internal cross-talk
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a highly integrated semiconductor sensor device with significantly reduced size and improved cross-talk performance, allowing for efficient integration in wearable devices while maintaining reliability and reducing optical losses.
Implementation Method 1
an opaque body arranged on a portion of the main surface that is free of the sensing surface and the emitter assembly
Implementation Method 2
a transparent structure arranged on the sensing surface... The transparent body, the opaque body and the emitter assembly are arranged such that their respective top surfaces form a common plane
Data Source
AI summary
A semiconductor sensor device includes an integrated circuit body having a main surface. The semiconductor device also includes a photosensitive element arranged on the main surface. The photosensitive element has a sensing surface. The semiconductor device further includes a transparent structure arranged on the sensing surface. The semiconductor device additionally includes an emitter assembly arranged on the main surface at a distance from the photosensitive element. The semiconductor device also includes an opaque body arranged on a portion of the main surface that is free of the sensing surface and the emitter assembly. The top surfaces of the transparent structure, the emitter assembly and the opaque body form a common plane. The transparent structure is a glass body.