Sensor Assembly Remetalized Bump Interconnect
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Solution Overview
Problem
Existing sensor systems face challenges with loose wire bonds leading to increased size and susceptibility to galvanic corrosion, making them unsuitable for flat assembly applications and prone to degradation at interconnects.
Innovation Solution
A sensor assembly with a metalized layer on a die substrate and remetalized bumps of a second metal material, electrically coupled to an electronics board with a conductive trace, using an adhesive for mechanical coupling, which reduces spatial requirements and enhances durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bond is used to connect sensor assembly to electronics board, then electrical connection is achieved, but interconnect size increases and mechanical stability deteriorates
Solution Approach 1:
The patent removes the loose wire from the interconnect structure by directly bonding the sensor assembly to the electronics board through a remetalized bump. This extraction of the wire eliminates the need for additional space and improves mechanical stability while maintaining electrical connection.
Solution Approach 2:
The patent combines the electrical connection function and mechanical attachment function into a single remetalized bump structure. The bump serves both as an electrical conductor and as a mechanical anchor point, eliminating the separate wire and improving overall reliability.
2Reliability
If wire bond is used to connect sensor assembly to electronics board, then electrical connection is achieved, but mechanical stability deteriorates
Solution Approach 1:
The patent combines the electrical connection function and mechanical attachment function into a single remetalized bump structure. The bump serves both as an electrical conductor and as a mechanical anchor point, eliminating the separate wire and improving overall reliability.
Solution Approach 2:
The sensor assembly is pre-bonded to the electronics board through the remetalized bump before final assembly. This preliminary mechanical attachment ensures stability and prevents disturbance of the connection during subsequent handling and installation.
3Ease of manufacture
If different metal materials are used in sensor assembly and electronics board traces, then manufacturing flexibility is improved, but galvanic corrosion susceptibility increases
Solution Approach 1:
The remetalized bump acts as an intermediary layer between the sensor assembly metal and the electronics board trace. This intermediate metal layer is specifically selected to be compatible with both materials, preventing direct contact between dissimilar metals and eliminating galvanic corrosion while maintaining manufacturing flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides stronger, more durable interconnects, reduces spatial requirements, and minimizes galvanic corrosion, resulting in improved mechanical and electrical stability across various environmental conditions.
Implementation Method 1
An adhesive is applied to the remetalized bump and facilitates mechanically coupling the sensor assembly to the sensor system
Data Source
AI summary
A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A remetalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the remetalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.