Temperature Sensor Assembly Vibration Resistance
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Solution Overview
Problem
Temperature sensing probes face premature failure and performance reduction due to harsh environmental and mechanical stress, despite protective packaging, which often results in inadequate protection against vibration and damage.
Innovation Solution
The development of temperature sensor assemblies with a temperature probe, mounting connector, wire set, transition component, and housing, along with a circuit that generates temperature characteristics, and a method for manufacturing that includes forming thermocouple junctions and securing components within a transition body and housing to enhance durability and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective packaging schemes are implemented to protect the measuring circuitry from environmental and mechanical stress, then the reliability of the temperature sensing probe is improved, but the manufacturing complexity and cost increase, and premature failure still occurs
Solution Approach 1:
The temperature sensing probe is divided into distinct modular segments: a protected sensing element housed in a sealed probe body, separate wiring harness, and individual protective components (grommets, connectors). This segmentation allows each component to be optimized independently for its specific function while simplifying the overall manufacturing process through standardized subassemblies.
Solution Approach 2:
The probe body and housing are designed with built-in protective features before the sensor components are installed. This includes pre-formed sealing structures, vibration-dampening mounting features, and stress-relief geometries that are integral to the housing design, providing protection against environmental and mechanical stress before the probe is deployed.
2Object-affected harmful factors
If protective packaging schemes are implemented to protect the measuring circuitry, then damage from environmental stress is reduced, but vibration protection remains inadequate leading to premature failure
Solution Approach 1:
Different portions of the probe structure are designed with specialized local properties: the probe body uses sealed construction for environmental protection, while the mounting features incorporate vibration-dampening characteristics. The wiring harness includes strain relief sections with flexible routing and protected connection points specifically designed to withstand vibration without compromising the overall probe reliability.
3Duration of action of stationary object
If the temperature sensor assembly is designed to withstand harsh environments and mechanical stress, then durability and performance are improved, but the manufacturing process becomes more complex
Solution Approach 1:
Protective features and structural reinforcements are incorporated into the housing and mounting components during the initial manufacturing stage rather than being added as separate protective layers or attachments. The probe body is pre-sealed and pre-configured with mounting features that facilitate straightforward assembly of the sensor elements, reducing the complexity of the overall manufacturing process while maintaining high durability standards.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved performance and durability in harsh environments, enabling the temperature sensor assemblies to withstand high temperatures and mechanical stress, with the ability to maintain accuracy and longevity, suitable for a wide range of applications including extreme temperatures up to 1200°C.
Implementation Method 1
joining a first end of the first conductor to a first end of the second conductor to form a thermocouple junction
Data Source
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Figure 2A
Figure 2B
AI summary
A temperature sensor assembly and method of manufacturing thereof having a temperature probe, a mounting connector, a wire set, a transition component, a housing, and a circuit is provided. The temperature probe includes a probe body, a temperature sensor and at least one conductor configured for providing a temperature signal indicative of a temperature over the at least one conductor. The circuit is enclosed within the housing and configured for receiving the temperature signal from the temperature probe and generating the temperature characteristic in response to the received temperature signal.