Sensor Conductive Layer Breakage Prevention via Auxiliary Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Photoelectric sensors face issues with poor conductivity due to the breakage of conductive layers on the side walls of insulation layers caused by material shrinkage, leading to poor signal transmission and noise interference.
Innovation Solution
The implementation of an auxiliary conductive layer on a thin conductive layer without additional processes, ensuring continuous signal transmission by smoothing the side walls of through holes and preventing direct contact between conductive and bias electrodes, thereby reducing leakage and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thin conductive layer is used to reduce material shrinkage, then the breakage of conductive layer is reduced, but the conductivity is insufficient
Solution Approach 1:
The patent combines a thin conductive layer with an auxiliary conductive layer to form a composite conductive structure. The thin conductive layer prevents breakage while the auxiliary conductive layer compensates for the reduced conductivity, achieving both reliability and electrical performance through material combination.
Solution Approach 2:
The patent uses composite material structure consisting of multiple conductive layers with different properties. The thin conductive layer provides mechanical stability and continuity, while the auxiliary conductive layer provides enhanced electrical conductivity, creating a composite system that resolves the contradiction between thickness and conductivity.
2Stability of the object's composition
If the conductive layer is made thinner to prevent breakage, then signal transmission continuity is improved, but the conductivity and signal transmission capability deteriorate
Solution Approach 1:
The patent merges the thin conductive layer (which ensures continuity) with the auxiliary conductive layer (which ensures transmission capability) into a unified conductive system. This combination allows the structure to maintain both signal transmission continuity and adequate signal transmission capability simultaneously.
Solution Approach 2:
The patent applies different conductive layer configurations to different regions or functions. The thin conductive layer is optimized for continuity and stability, while the auxiliary conductive layer is optimized for conductivity and signal transmission, allowing each layer to perform its specialized function effectively.
3Device complexity
If no auxiliary conductive layer is added to keep the structure simple, then the manufacturing process remains simple, but the conductivity is poor and signal transmission is affected
Solution Approach 1:
The patent integrates the auxiliary conductive layer into the existing conductive layer structure, merging their functions into a unified system. This approach enhances conductivity without creating entirely separate systems, thereby minimizing the increase in structural complexity while achieving the desired electrical performance improvement.
4Object-generated harmful factors
If additional processes are added to improve conductivity, then the conductivity and signal transmission are improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the formation of the thin conductive layer and auxiliary conductive layer into an integrated manufacturing sequence. By merging these steps into a coordinated process flow, the patent achieves improved conductivity through multiple layers while minimizing the increase in manufacturing complexity compared to separate, independent processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances conductivity and maintains normal signal transmission by preventing conductive layer breakage and minimizing noise interference, improving the signal-to-noise ratio without requiring extra manufacturing steps.
Implementation Method 1
The photodiodes receive light and convert optical signals into electrical signals
Data Source
Figure 1~2
Figure 3
Figure 4A~4D
AI summary
A sensor, a manufacturing method thereof and an electronic device. The sensor (100) includes: a base substrate (101); a thin-film transistor (TFT) (102) disposed on the base substrate and including a source electrode (1025); a first insulation layer (106) disposed on the TFT (102) and provided with a first through hole (1071) running through the first insulation layer (106); a conductive layer (1031) disposed in the first through hole (1071) and on part of the first insulation layer (106) and electrically connected with the source electrode (1025) via the first through hole (1071); a bias electrode (1032) disposed on the first insulation layer (106) and separate from the conductive layer (1031); a sensing active layer (1033) respectively connected with the conductive layer (1031) and the bias electrode (1032); and an auxiliary conductive layer (1034) disposed on the conductive layer (1031). The sensor and the manufacturing method thereof improve the conductivity and ensure normal transmission of signals by arranging the auxiliary conductive layer (1034) on the conductive layer without addition of processes.