Semiconductor Sensor Barrier Membrane for Contamination Control
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Solution Overview
Problem
Existing semiconductor packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, relatively low performance, and package sizes that are too large.
Innovation Solution
A packaged electronic device structure and associated methods that include a barrier disposed adjacent to a surface of an electronic device, featuring a membrane with barrier strands and through-holes, and optional conformal membrane layers or protrusion patterns to reduce contamination and improve manufacturability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but reliability is decreased and cost is excessive
Solution Approach 1:
The barrier structure is segmented into multiple functional components including barrier strands, through-holes, conformal membrane layers, and protrusion patterns. This segmentation allows each component to address specific contamination pathways while maintaining overall system reliability without requiring complete redesign of the entire package structure.
Solution Approach 2:
The barrier structure acts as an intermediary element positioned between the electronic device and the external environment. It mediates contamination prevention by intercepting contaminants before they reach the device, thereby improving reliability without requiring direct modification of the device itself.
2Ease of manufacture
If conventional packages are used, then manufacturing process is simpler, but cost is excessive
Solution Approach 1:
The barrier utilizes thin film structures including conformal membrane layers that conform to underlying topography. These thin films provide effective contamination barriers while minimizing material consumption, thereby reducing cost without sacrificing manufacturing ease.
Solution Approach 2:
The barrier incorporates porous structures such as through-holes and barrier strands with controlled porosity. These porous elements provide effective contamination filtration while using minimal material, addressing both cost reduction and manufacturing simplicity requirements.
3Reliability
If conventional packages are used, then package size is acceptable, but performance is relatively low
Solution Approach 1:
The barrier structure employs nested configurations where conformal membrane layers wrap around protrusion patterns, and barrier strands are positioned within defined geometries. This nesting allows multiple protective functions to be integrated within a compact volume, improving reliability without significantly increasing package size.
4Object-affected harmful factors
If barrier structure with conformal membrane layers is added, then contamination protection is improved, but manufacturing complexity increases
Solution Approach 1:
The conformal membrane layers are formed by controlling deposition parameters to achieve uniform thickness and coverage. By optimizing deposition parameters such as thickness and conformality, effective contamination protection is achieved while maintaining manufacturing processability and avoiding excessive complexity.
Data Source
AI summary
In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.