Semiconductor Sensor Barrier Membrane for Diaphragm Contamination Control
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Solution Overview
Problem
Existing semiconductor packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, relatively low performance, and oversized packages.
Innovation Solution
A packaged electronic device structure and associated methods that include a barrier disposed adjacent to a surface of an electronic device, featuring a membrane with barrier strands and through-holes, and optional conformal membrane layers or protrusion patterns to reduce contamination and improve manufacturability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but reliability decreases due to contamination risks
Solution Approach 1:
The packaging structure is divided into multiple functional layers including a base layer, a barrier layer with patterned openings, and a cover layer. This segmentation allows each layer to perform its specific function (support, contamination protection, sealing) independently, improving reliability without creating an unmanageably complex structure.
Solution Approach 2:
A barrier layer is introduced as an intermediary component between the electronic device and the external environment. This intermediate layer with controlled openings acts as a mediator that selectively allows necessary interactions (ventilation, bonding) while blocking harmful contaminants, thus improving reliability without requiring complete structural redesign.
2Reliability
If conventional packaging structures are used, then manufacturing cost is controlled, but performance decreases due to oversized packages
Solution Approach 1:
The barrier layer is implemented as a thin film structure with patterned openings rather than a bulky conventional seal. This thin film approach provides effective contamination protection and structural integrity while occupying minimal space, allowing high reliability without increasing package volume.
Solution Approach 2:
The packaging structure transitions from traditional horizontal layering to a more vertical, compact arrangement where the barrier layer with its patterned openings creates a three-dimensional filtration path. This dimensional optimization allows effective contamination blocking within a reduced overall package footprint.
3Object-affected harmful factors
If simple barrier structures are used, then manufacturing ease is maintained, but harmful factors increase due to contamination
Solution Approach 1:
The barrier layer features patterned openings with varying sizes and distributions tailored to specific functional requirements. Different regions of the barrier have different opening patterns optimized for their local functions (ventilation, bonding access, contamination blocking), providing superior protection without requiring a completely complex structure throughout.
Solution Approach 2:
The barrier layer is formed as a composite structure combining organic and inorganic materials with complementary properties. This composite approach provides enhanced contamination protection and structural stability while maintaining manufacturing feasibility through established deposition techniques.
Data Source
AI summary
In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent to an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.