Sensor Base Plate Conductive Polymer In-Mold Formation

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Solution Overview

Problem

Existing in vivo analyte sensing devices face challenges with preformed conductive sponge rubber elements, including difficulty in achieving precise dimensions, abrasive properties damaging the conductive coating, pressure issues, and a high likelihood of short circuits due to their porous structure.

Innovation Solution

A method of directly forming an elastomeric conductive polymer element within the recess of a sensor base plate using a curable conductive polymer composition, which is injected and cured in situ, providing reproducible dimensions and firm adherence without external adhesives, and allowing for complex three-dimensional shapes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If preformed conductive sponge rubber elements are used, then electrical contact between sensor and electronics unit is provided, but short circuits occur due to porous structure and fiber displacement

Engineering Contradiction:
Improveelectrical contact reliabilityVSAvoidshort circuit risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the material parameters by transitioning from traditional sponge rubber to conductive polymer composition, which fundamentally alters the electrical and mechanical properties to eliminate short circuits while maintaining conductivity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining conductive fillers (such as carbon black, metal particles, or conductive polymers) within a polymer matrix to create an elastomeric conductive material that provides both electrical conductivity and mechanical flexibility without the porous structure problems of sponge rubber

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If preformed sponge rubber elements are cut from bulk material, then manufacturing is simplified, but precise dimensional control is difficult

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoiddimensional precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical cutting process with an injection molding process, where the curable conductive polymer composition is injected directly into a mold cavity defined by the recess, allowing precise dimensional control through the mold geometry rather than post-manufacturing cutting

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent performs preliminary action by pre-defining the exact dimensions and shape of the conductive element through the mold cavity before the actual manufacturing, ensuring that every element is formed with precise dimensions from the start rather than requiring subsequent trimming or adjustment

Inventive Principle:
Principle #10Preliminary action

3Ease of operation

If preformed sponge rubber elements are inserted into recess, then assembly is simple, but elements may fall out due to insufficient fixation

Engineering Contradiction:
Improveassembly simplicityVSAvoidelement retention
Core Design Contradiction:
Ease of operationVSStability of the object's composition

Solution Approach 1:

The patent merges the conductive element formation with the base plate manufacturing process itself, where the elastomeric conductive polymer element is formed in situ within the recess of the base plate, eliminating the separate insertion step and ensuring inherent retention through integrated formation

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces the curable conductive polymer composition as an intermediary that, when cured, acts as both the conductive element and the bonding agent, simultaneously providing electrical conductivity and mechanical retention without requiring separate fixation mechanisms

Inventive Principle:
Principle #24Intermediary (Mediator)

4Reliability

If conductive sponge rubber elements are used, then electrical conductivity is provided, but abrasive properties damage the conductive coating of substrate

Engineering Contradiction:
Improveelectrical conductivityVSAvoidabrasive damage
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the material parameters by replacing sponge rubber with elastomeric conductive polymer, which has different surface properties and lower abrasiveness while maintaining electrical conductivity through the conductive filler network within the polymer matrix

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution prevents short circuits and ensures reliable electrical contact by forming an elastomeric conductive polymer element that adheres to the sensor base plate without deformation, addressing the limitations of preformed sponge rubber elements.

Implementation Method 1

a curable conductive polymer composition, i.e., a curable polymer composition comprising at least one electrically conductive additive, is passed, typically by injection, into a recess of a raw sensor base plate either in a free dose manner or in a closed mold under pressure and subsequently cured

Methodology Applied
Scientific EffectCuring: Phase Change

Data Source

PatentUS20230233111A1Method for manufacturing a sensor base plate for an in vivo analyte sensing device
Publication Date: 2023.07.27 ROCHE DIABETES CARE INC
  • US20230233111A1 patent drawing
  • US20230233111A1 patent drawing

AI summary

This disclosure relates to a method of manufacturing an in vivo analyte sensing device, which is adapted for detecting at least one analyte in a body fluid or tissue and an in vivo analyte sensing device obtainable by said manufacturing method. Further, this disclosure relates to a method of manufacturing a sensor base plate and a sensor base plate obtainable by said manufacturing method. The sensor base plate may be used for the manufacture of an in vivo analyte sensing device.