Sensor Board Gap Filling via Capillary Action and Surface Tension Control
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Solution Overview
Problem
Conventional methods for manufacturing sensor boards with multiple hybrids result in material residues at the peripheral edges, impairing the mechanical and thermal stability of X-ray detectors, leading to reduced efficiency in high-resolution imaging applications.
Innovation Solution
A method utilizing the capillary effect to fill gaps between sensor layers and reader units without external pressure, ensuring that edge regions remain free of filling material by adjusting the geometry of the components and using a filling material with suitable surface tension, allowing for controlled filling and preventing material overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional adhesive filling methods are used to fill gaps between components, then the gap is filled, but material residues remain at the peripheral edge
Solution Approach 1:
The peripheral edge of the carrier is prepared in advance with a coating that has lower surface tension than the filling material. This preliminary surface treatment ensures that when the filling material is applied, it will not adhere to the coated edge region, preventing material residues before they can form
Solution Approach 2:
The invention utilizes the surface tension difference between the filling material and the coated edge surface to prevent material residues. By intentionally creating a surface with lower surface tension at the edge, the filling material naturally repels from this region, converting a potential harmful residue problem into a controlled filling process that leaves clean edges
2Ease of manufacture
If solder elements are used to secure sensor layer on reader units, then components are connected, but mechanical and thermal stability is impaired
Solution Approach 1:
The invention replaces the mechanical solder element connection system with a direct adhesive bonding system. The adhesive is applied between the sensor layer and reader unit, eliminating the need for solder bumps and their associated mechanical stress concentrations, thereby improving overall mechanical and thermal stability while maintaining ease of manufacture
Solution Approach 2:
The invention changes the bonding mechanism from mechanical interlocking via solder elements to chemical adhesion via adhesive materials. This parameter change in the connection method eliminates the discontinuities and stress points introduced by solder bumps, resulting in improved mechanical and thermal stability of the assembled components
3Productivity
If multiple hybrids are arranged on a sensor board, then the signal yield increases, but material residues form at intermediate edges
Solution Approach 1:
The intermediate regions between adjacent hybrids on the carrier are pre-coated with a low surface tension material before the filling material is applied. This preliminary coating creates a barrier that prevents the filling material from adhering to the intermediate edge regions, allowing multiple hybrids to be arranged closely without generating material residues at the intermediate edges
Solution Approach 2:
The invention converts the potential problem of material residues at intermediate edges into a controlled filling process by applying a surface treatment to these regions. The surface tension difference causes the filling material to naturally avoid these intermediate regions, allowing close arrangement of multiple hybrids while maintaining clean intermediate edges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the unproblematic manufacturing of sensor boards with multiple hybrids, maintaining mechanical and thermal stability while preventing material residues, thus enhancing the performance and efficiency of X-ray detectors.
Implementation Method 1
A method utilizing the capillary effect to fill gaps between sensor layers and reader units without external pressure
Implementation Method 2
using a filling material with suitable surface tension, allowing for controlled filling and preventing material overflow
Data Source
AI summary
A sensor board for a detector module is disclosed. It includes, in a stack construction, at least one reader unit and a sensor layer arranged spaced from the reader unit in the direction of the stack. A gap formed by the spacing between the sensor layer and the reader unit is filled with a cured filling material such that at least one edge region of the sensor layer is free of the filling material. Furthermore, a method is disclosed for manufacturing a corresponding sensor board, and a detector module is disclosed for an X-ray detector having a number of sensor boards which are arranged to be mutually adjacent on a module carrier.