Sensor Board Light Shielding Member Bonded to Substrate

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Solution Overview

Problem

Existing radiation imaging sensor boards face challenges in implementing a simpler structure for light receiving and light shielding regions, particularly due to environmental factors like temperature variations affecting pixel output, and lack a scintillator for acquiring radiation images.

Innovation Solution

A sensor board design featuring a substrate with a pixel region divided into areas for radiation image generation and correction, where a scintillator overlaps the image region but not the correction region, and a light shielding member covers the scintillator and correction region, improving structural simplicity and adaptability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a scintillator and light shielding member are added to the sensor board, then radiation image acquisition capability is improved, but device complexity increases

Engineering Contradiction:

Improveradiation image acquisition capabilityVSAvoidsensor board structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The light shielding member is integrated with the substrate structure, combining the light shielding function with the existing substrate. The scintillator is positioned to overlap with the first region while the light shielding member covers both the scintillator and second region, merging multiple functions into a unified structure that reduces overall complexity despite adding radiation imaging capability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The light shielding member serves multiple functions: it shields the second region from light, covers the scintillator, and provides structural support. The pixel region is divided into first and second regions where the first region captures radiation images while the second region provides correction signals, making the sensor board multi-functional for both image acquisition and offset correction

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If photolithography steps are used to create light receiving and light shielding regions, then manufacturing precision is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvelight receiving and light shielding region definitionVSAvoidmanufacturing process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The light shielding member is extracted as a separate component that can be independently positioned and bonded to the substrate, rather than being created through complex photolithography steps. This extraction allows for simpler manufacturing while maintaining precise positioning through bonding processes

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The photolithography process is replaced with a bonding process to attach the light shielding member. Instead of using chemical photolithography to define regions, the patent uses mechanical bonding to position the light shielding member, simplifying the manufacturing process while achieving the same functional division between light receiving and light shielding regions

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the sensor board's ability to maintain accurate radiation image capture and correction signals, improving image quality and operational flexibility by simplifying the structure and reducing the need for complex photolithography steps.

Implementation Method 1

a scintillator arranged on one of the first principal surface and a second principal surface of the two principal surfaces

Methodology Applied

Scientific EffectScintillation: Scintillation

Implementation Method 2

a light shielding member arranged on the principal surface of the two principal surfaces on which the scintillator is arranged

Methodology Applied

Scientific EffectLight shielding: Absorption (EM radiation)

Data Source

PatentUS12253639B2Sensor board, radiation imaging apparatus, radiation imaging system, and method of manufacturing sensor board

Publication Date: 2025.03.18 CANON KK

AI summary

A sensor board comprising a substrate comprising a pixel region where pixels are arranged on a first surface of two surfaces, a scintillator arranged on one of the first surface and a second surface of the two surfaces and a light shielding member arranged on the surface on which the scintillator is arranged, is provided. The pixel region comprises a first region where a signal for radiation image is generated and a second region where a signal for correcting a signal output from the first region is generated. The scintillator is arranged to overlap the first region but not to overlap the second region. The light shielding member is arranged to cover the scintillator and overlap the second region. A portion of the light shielding member overlapping the second region is bonded to the surface on which the scintillator is arranged.