Sensor Board Production Method for X-Ray Detector Modules
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Solution Overview
Problem
Conventional methods for producing multi-hybrid sensor boards for X-ray detectors are time-consuming and subject to undesirable thermal and mechanical stresses due to the repetitive process steps required for fixing multiple reader units to the sensor layer.
Innovation Solution
A method where all reader units are positioned on the sensor layer simultaneously and then fastened in a single process step using soldering elements, such as solder globules or paste, which are heated simultaneously in a reflow furnace to form a hybrid, reducing production time and minimizing thermal and mechanical loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reader units are fixed to the sensor layer one by one using conventional soldering methods, then each reader unit can be securely connected, but the production time increases and thermal and mechanical stresses are repeated multiple times
Solution Approach 1:
The patent combines multiple individual soldering operations into a single collective soldering process. All reader units are positioned on the sensor layer first, then all are soldered simultaneously in one reflow cycle, merging what were previously separate sequential operations into one unified process step.
Solution Approach 2:
The patent performs preliminary positioning of all reader units on the sensor layer before the soldering process. This preliminary arrangement allows all units to be in place and ready for the single collective soldering operation, rather than positioning and soldering each unit individually.
2Reliability
If reader units are fixed one by one with individual heating steps, then each connection can be ensured, but undesirable thermal and mechanical stresses occur
Solution Approach 1:
The patent merges multiple separate heating cycles into one collective reflow soldering process. All reader units are soldered in a single thermal cycle, eliminating the repeated thermal expansion and contraction that would occur with multiple individual heating steps.
Solution Approach 2:
The patent converts the potentially harmful repeated thermal cycling into a beneficial single thermal process. By performing all soldering in one reflow cycle, the thermal stress is applied once in a controlled manner rather than repeatedly, turning what could be a harmful repeated stress into a beneficial one-time bonding process.
3Manufacturing precision
If multiple method steps are carried out for each reader unit, then precise positioning and soldering can be achieved, but the process complexity increases
Solution Approach 1:
The patent merges multiple process steps (positioning and soldering for each reader unit) into fewer collective steps. All reader units are positioned in one operation and then all are soldered in one reflow process, reducing the total number of sequential steps while maintaining precision through proper tooling and process control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens production time, prevents undesirable thermal and mechanical stress, and allows for high-precision soldering of reader units on the sensor layer, facilitating efficient mass production of sensor boards for detector modules.
Implementation Method 1
By a subsequent heating of the solder material which is generally carried out by specific temperature adjustment of the mounting tools used for positioning the components, the components are connected together. This is referred to as so-called reflow soldering.
Implementation Method 2
soldering elements from a low-melting solder material are used as contact or connecting elements
Data Source
AI summary
A method is disclosed for producing a hybrid, incorporable into a sensor board, for a detector module including a plurality of reader units. An embodiment of the method includes positioning the reader units in a stacked construction, each on a common sensor layer. The method further includes, after all of the reader units are positioned, fixing the reader units together on the sensor layer, thereby forming the hybrid. An embodiment of the invention further relates to a detector module for an X-ray detector including a number of sensor boards arranged adjacent to one another on a module carrier. The sensor boards are produced by an embodiment of the method.