Sensor Board Socket Connection Inspection

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Solution Overview

Problem

Conventional testing methods for detecting the connection between socket pins and printed circuit boards face challenges such as limited inspection coverage and blind spots due to signal delivery obstacles, especially in high wire-density situations or on probe-inaccessible surfaces.

Innovation Solution

A testing system comprising a testing signal source, a signal sensing unit with a sensor board and probe, and an analysis unit, where the sensor board is disposed between the socket and a fixing element to detect and analyze sensing signals, allowing for effective inspection even in complex configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional testing methods are used for detecting socket connections, then the testing process is simple, but the inspection coverage is limited and blind spots occur in high wire-density areas and probe-inaccessible surfaces

Engineering Contradiction:
Improveinspection coverageVSAvoidtesting system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent introduces a sensor board as an intermediary component between the socket and the testing system. This sensor board contains sensing circuits that can detect electrical signals from the socket pins, acting as a mediator that bridges the gap between the difficult-to-access socket connections and the testing equipment, thereby eliminating blind spots in high wire-density areas without requiring direct probe access to all connection points

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transitions from direct electrical contact testing to a field-based sensing approach. By using sensing circuits on the sensor board that detect electrical fields or signal characteristics, the system moves from one-dimensional direct contact measurement to multi-dimensional field detection, enabling inspection of areas that are physically inaccessible to traditional probes

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If the sensor board is disposed between the socket and fixing element to enhance inspection coverage, then the inspection accuracy improves, but the device complexity increases

Engineering Contradiction:
Improveinspection accuracyVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The sensor board is designed with multi-functionality, serving both as a structural support element (fixing element) and as an active sensing component. The sensor board can detect multiple signal parameters simultaneously and works with different socket types, reducing the need for separate testing fixtures and minimizing overall device complexity despite enhanced inspection capabilities

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the sensing function with the structural fixing element into a single integrated sensor board assembly. By combining the mechanical support function and the electrical sensing function into one component, the system reduces the number of separate parts and interfaces, thereby limiting the increase in device complexity while achieving improved inspection accuracy

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7855567B2Electronic device testing system and method
Publication Date: 2010.12.21 TEST RES INC
  • US7855567B2 patent drawing
  • US7855567B2 patent drawing
  • US7855567B2 patent drawing

AI summary

The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and an analysis unit. The signal sensing unit comprises a sensor board, a probe, and an operation amplifier. The sensor board is electrically coupled to the socket, and the sensor board has a probing point. The probe is selectively contacted with the probing point of the sensor board for receiving and outputting a sensing signal. The operation amplifier is electrically connected to the probe for receiving, amplifying and outputting the sensing signal. The fixing element is used for fixing the sensor board between the socket and the fixing element.