Sensor Bond Integrity Verification via Stimuli Monitoring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional strain gauges face accuracy issues due to bond degradation between the sensor and the structure over time, leading to incomplete or misleading measurements, and existing inspection methods are time-consuming and often inconclusive, especially for sensors in inaccessible locations.
Innovation Solution
A method and system for verifying sensor bond integrity by applying stimuli to the sensor and monitoring physical property outputs, generating measured data, and comparing it to reference data to determine the bond condition between the sensor and the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional strain gauges are used with adhesive bonding, then the sensor can be attached to the structure for measurement, but the bond degrades over time due to fatigue, corrosion, moisture, and temperature extremes leading to inaccurate measurements
Solution Approach 1:
The patent replaces the mechanical adhesive bonding system with a direct structural integration system where the strain gauge becomes an integral part of the structure through co-curing or monolithic construction. This eliminates the adhesive layer that degrades over time, allowing the sensor to maintain reliable bond integrity throughout the entire service life of the structure without suffering from fatigue, corrosion, or moisture-related bond failure.
2Measurement precision
If visual or tactile inspection methods are used to check bond integrity, then some assessment can be made, but the process is time-consuming and often inconclusive especially for sensors in inaccessible locations
Solution Approach 1:
The patent implements self-monitoring capabilities where the strain gauge system automatically detects and reports its own bond integrity status through embedded sensors that continuously monitor parameters such as bond strength, adhesion quality, and structural attachment conditions. This eliminates the need for manual visual or tactile inspections, providing precise bond integrity assessment without time loss and making monitoring possible even for sensors in completely inaccessible locations.
3Adaptability or versatility
If sensors are placed in inaccessible locations for structural monitoring, then critical areas can be monitored, but conventional inspection methods cannot effectively verify bond integrity
Solution Approach 1:
The patent replaces manual inspection mechanisms with automated remote monitoring systems that use embedded sensors and wireless communication to transmit bond integrity data from inaccessible locations. The strain gauges are integrated directly into the structure through co-curing techniques, allowing them to be placed in hard-to-reach areas while maintaining verification capability through automated electronic monitoring rather than physical inspection.
Solution Approach 2:
The patent introduces intermediary electronic monitoring systems and data transmission mechanisms that act as mediators between the remotely located sensors and the inspection system. These intermediaries enable bond integrity verification by transmitting sensor data and status information back to accessible locations where analysis can be performed, eliminating the need for physical access to the sensor location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the efficiency and reliability of measuring physical properties by accurately assessing bond integrity, reducing the risk of incomplete or misleading data and enabling timely detection of bond degradation.
Implementation Method 1
a strain gauge is a strain-sensitive device employed to sense strain, such as that caused by stress in the form of tensile or compressive forces applied to a structure
Data Source
AI summary
Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property. Structures having one or more sensors bonded thereto and an associated sensing system for determining bond integrity between the one or more sensors and the structure are also disclosed.