Fingerprint Sensor Bonding Alignment for Display Panel Parallelism
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Solution Overview
Problem
The parallelism between the rear surface of a display panel and the front surface of a fingerprint sensor affects the performance of the fingerprint sensor, leading to suboptimal recognition capabilities.
Innovation Solution
A bonding device and method that include a picker and a stage with adjustable inclinations, distance measuring units, and a controller to align and bond the fingerprint sensor to the display panel, ensuring parallelism and optimal flatness between the two surfaces using a vertical driving unit and adhesive application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the fingerprint sensor is bonded to the display panel without inclination adjustment, then the bonding process is simple and fast, but the parallelism between the sensor surface and display panel surface deteriorates, leading to suboptimal fingerprint recognition performance
Solution Approach 1:
The bonding device incorporates adjustable inclination mechanisms that allow the picker and stage to be dynamically tilted at predetermined angles. This enables the sensor surface and display panel surface to be bonded at non-zero inclinations, improving parallelism and fingerprint recognition performance while maintaining a relatively simple device structure through controlled dynamic adjustment rather than complex multi-axis positioning
Solution Approach 2:
The device changes the bonding parameters by introducing predetermined inclination angles for the picker and stage. By adjusting the inclination parameters of the bonding surfaces, the system achieves improved parallelism between the sensor and display panel without requiring complex real-time positioning systems, thus resolving the contradiction between precision and device complexity
2Reliability
If distance measuring units and inclination adjustment mechanisms are added to ensure parallelism, then fingerprint recognition performance is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The distance measuring units measure the distances to be bonded surfaces before the bonding process, and the inclination adjustment mechanisms are pre-configured with predetermined angles. This preliminary measurement and adjustment approach ensures that the sensor and display panel are bonded with optimal parallelism for fingerprint recognition, while avoiding the need for complex real-time control systems during the actual bonding process
Solution Approach 2:
The distance measuring units provide feedback information about the positions of the sensor and display panel surfaces. This feedback is used by the controller to adjust the inclination of the picker and stage, ensuring that the bonding occurs at the optimal predetermined inclination angles. This feedback mechanism improves reliability through precise positioning while keeping the device structure relatively simple by using direct distance measurement rather than complex multi-sensor arrays
Data Source
AI summary
A device for bonding a fingerprint sensor to a display panel including a picker for securing a rear surface of a fingerprint sensing unit with a first planar surface having a (1-1)-th inclination, a stage for securing a front surface of the display panel with a second planar surface having a (2-1)-th inclination, distance measuring units for measuring distances to first points on a front surface of the fingerprint sensing unit and to second points on a rear surface of the display panel, a controller outputting a control signal that adjusts an inclination of the first planar surface or the second planar surface, an inclination adjusting unit for adjusting an inclination of the first and planar surfaces, and a vertical driving unit for moving at least one of the first and second planar surfaces along a first direction to bond the fingerprint sensing unit to the display panel.