Sensor Device Bonding Wire Intersecting Surface Geometry
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Solution Overview
Problem
Existing sensor devices face challenges in reducing the height dimension due to protruding bonding wires, which limits their shape and dimension flexibility, and also experience stress transfer that can affect detection accuracy.
Innovation Solution
The sensor device incorporates bonding wires that connect intersecting connection surfaces, reducing the need for additional wiring members and minimizing stress transfer by using a configuration where the bonding wires directly connect the sensor element and substrate, with a supporting member and coupling member to manage stress and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires connect upper surfaces facing the same direction, then electrical connection between sensor element and substrate is achieved, but the bonding wire protrudes and increases the height dimension
Solution Approach 1:
The patent changes the connection geometry from parallel surfaces to intersecting surfaces. The bonding wire connects a first surface of the sensor element to a second surface of the substrate that intersects with the first surface, allowing the wire to lie flat against the surfaces rather than protruding vertically. This dimensional change in connection geometry eliminates the height increase problem while maintaining electrical connectivity.
2Reliability
If bonding wires protrude from the sensor element surface, then electrical connection is established, but the shape and dimension flexibility of the sensor device is limited
Solution Approach 1:
By transitioning from connecting parallel upper surfaces to connecting intersecting surfaces, the bonding wire can be routed along the intersection line rather than protruding outward. This allows the wire to be concealed within the device profile, enabling flexible shaping of the external contours while maintaining reliable electrical connections.
3Reliability
If additional wiring members are used to connect sensor element and substrate, then electrical connection is achieved, but device complexity increases
Solution Approach 1:
The patent merges the electrical connection function directly into the bonding wire configuration by connecting intersecting surfaces. This eliminates the need for separate wiring members or additional connection structures, as the bonding wire itself utilizes the surface intersection to achieve both mechanical attachment and electrical connectivity without requiring extra components.
Data Source
AI summary
A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.