Input Sensor Bridge Contact Structure for Low-Resistance Displays
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Solution Overview
Problem
The challenge in existing display devices is the high contact resistance between conductive layers of input sensors, which affects the performance of touch-based input schemes.
Innovation Solution
A display device design that includes a bridge pattern electrically connected through contact holes, with specific conductive layers having varying resistance values and overlapping opening portions to reduce contact resistance, and a method for manufacturing this structure using a shared mask for etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive layers are connected through contact holes in input sensors, then electrical connection is achieved, but contact resistance increases
Solution Approach 1:
The patent applies composite materials by stacking multiple conductive layers with different resistance values (e.g., ITO layer with higher resistance and metal alloy layer with lower resistance) to form a bridge pattern. This composite structure allows the conductive path to have both transparent properties and low contact resistance, resolving the contradiction between electrical connection quality and sensor performance.
Solution Approach 2:
The patent applies local quality by making the contact hole region have different properties from the bulk conductive layers. The contact hole is filled with a low-resistance material or structured to reduce contact resistance specifically at the connection point, while the rest of the conductive layers maintain their original properties for transparent conductive oxide functionality.
2Object-affected harmful factors
If multiple conductive layers are stacked to reduce resistance, then contact resistance decreases, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the conductive path into multiple segments (multiple conductive layers) with specific functions. Each layer is deposited separately using standard semiconductor manufacturing processes, allowing the complex multi-layer structure to be built incrementally through familiar deposition and patterning steps.
Solution Approach 2:
The patent applies parameter changes by varying the material composition and thickness of different conductive layers to optimize resistance characteristics. By controlling the resistance value of each layer (e.g., using different metal alloys or oxide compositions), the overall contact resistance is reduced while maintaining manufacturability through standard material processing techniques.
3Reliability
If bridge pattern is added to connect conductive layers, then electrical connectivity improves, but manufacturing process steps increase
Solution Approach 1:
The patent applies merging by combining the bridge pattern formation with existing conductive layer deposition processes. The bridge pattern is formed by patterning the same conductive layers that make up the sensor electrodes, so that the connection structures and functional elements are created in integrated manufacturing steps rather than as separate additions.
Data Source
AI summary
A display device includes a display panel and an input sensor. The input sensor may include a first detection pattern, and a first detection electrode including a bridge pattern electrically connected to the first detection pattern. The bridge pattern may include a (1-1)-th conductive layer, and a (1-2)-th conductive layer, and the first detection pattern may include a (2-1)-th conductive layer, and a (2-2)-th conductive layer. A first opening portion that exposes the one surface of the (1-1)-th conductive layer may be defined in the (1-2)-th conductive layer, and a second opening portion that exposes the one surface of the (2-1)-th conductive layer may be defined in the (2-2)-th conductive layer. The one surface of the (1-1)-th conductive layer and the one surface of the (2-1)-th conductive layer may be in contact with each other.