Thermoplastic Sensor Carrier Bonding in Fiber-Reinforced Composites
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Solution Overview
Problem
Existing sensor arrangements for fiber-reinforced plastics lack secure anchoring and spatial positioning, which compromises the mechanical stability of structural elements and reliability of parameter detection.
Innovation Solution
A sensor arrangement where a thermoplastic sensor carrier forms a material bond with the structural element during production, using a polyetherimide film that integrates between layers or on surfaces, ensuring a secure and mechanically stable connection without impairing the structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a sensor structure is arranged on a flexible carrier, then the sensor can be easily positioned, but the sensor structure is not securely anchored to the structural element
Solution Approach 1:
The sensor carrier is merged with the structural element through material bonding during the curing process. The thermoplastic sensor carrier material bonds with the matrix of the fiber-reinforced plastic structural element, creating a unified structure where the sensor carrier becomes an integral part of the structural element rather than a separate component.
Solution Approach 2:
The sensor carrier is positioned in advance on the structural element before the curing process begins. The carrier is placed in the desired location and orientation, then the structural element is cured to permanently fix the sensor carrier in position through material bonding, ensuring both easy positioning and secure anchoring.
2Reliability
If the sensor carrier is securely anchored to the structural element, then reliable parameter detection is achieved, but the mechanical stability of the structural element may be impaired
Solution Approach 1:
The sensor carrier material undergoes parameter changes during the curing process, transitioning from a flexible, easily positionable state to a bonded, integrated state. The thermoplastic material's bonding characteristics are optimized to create strong adhesion to the matrix while maintaining the overall mechanical integrity of the structural element.
Solution Approach 2:
The sensor carrier is made from composite or specially formulated thermoplastic material that combines ease of positioning with bonding capability. This composite material allows the carrier to be easily placed initially, then forms a strong material bond with the structural element's matrix during curing, achieving both reliable anchoring and mechanical stability.
3Reliability
If a thermoplastic sensor carrier is used that bonds during production, then secure anchoring is achieved, but the process complexity increases
Solution Approach 1:
The sensor carrier integration process is merged with the existing curing process of the structural element. Instead of requiring separate anchoring steps, the sensor carrier is positioned and then the structural element is cured, which simultaneously bonds the carrier to the matrix. This combines multiple functions into a single process step.
Solution Approach 2:
The curing process serves dual purposes: it cures the structural element's matrix and simultaneously bonds the sensor carrier to the matrix. The material bonding occurs automatically during the curing process without requiring additional anchoring operations, allowing the process to service multiple functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for reliable detection of process parameters while maintaining the mechanical stability of the structural element, enhancing its mechanical properties and providing fire protection, with the ability to record temperature and other parameters without altering the component's geometry or weight significantly.
Implementation Method 1
the sensor carrier enters into a material bond with its matrix when the structural element is produced
Implementation Method 2
the sensor carrier is formed from a thermoplastic material
Implementation Method 3
Polyetherimide as the flexible substrate of the sensor carrier can advantageously dissolve on the surface during the curing process
Data Source
Figure 1
AI summary
The invention relates to a sensor arrangement (10) for detecting at least one process parameter or state variable on a structural element (1). The structural element (1) is formed from a matrix of at least one fiber-reinforced plastic, wherein the sensor arrangement (10) has at least one sensor structure (15) arranged on a sensor carrier (20). In order to have a sensor arrangement (10) available for application on a structural element (1) that allows for a secure arrangement of the sensor structure (15) and does not restrict the mechanical stability of the structural element (1), it is proposed to form the sensor carrier (20) from a high-performance thermoplastic and to allow the sensor carrier (20) to form a material-bonded connection with the matrix of the structural element (1) during its manufacture.