Sensor Carrier Stress Compensation via Embedded Structures
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Solution Overview
Problem
Micromechanical sensors face precision limitations due to stress-induced errors caused by material expansion coefficients, leading to signal deviations and temperature-induced warping, which existing methods struggle to compensate for cost-effectively.
Innovation Solution
Integration of stress-measuring structures, such as piezoelectric or piezoresistive sensors, into the sensor carrier to measure and compensate for stress influences, allowing for calibration and signal correction in the evaluation circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If spring structures are used in the sensor element for stress decoupling, then stress-induced errors are compensated, but device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent replaces complex mechanical spring structures with an electrical measurement and compensation system. Stress-measuring structures (piezoelectric or piezoresistive) are integrated into the sensor carrier to detect stress, and an evaluation circuit processes these signals to compensate for stress-induced measurement errors electronically, eliminating the need for mechanical stress-decoupling elements.
Solution Approach 2:
The patent introduces stress-measuring structures as intermediary elements that detect stress in the sensor carrier and provide feedback signals. These intermediary structures enable the evaluation circuit to determine stress-induced measurement errors and apply appropriate compensation, serving as a mediator between the physical stress state and the electronic compensation mechanism.
2Measurement precision
If a thick stress-decoupling soft adhesive layer is used between the sensor element and carrier, then stress-induced errors are reduced, but wire bonding quality deteriorates and service life is limited
Solution Approach 1:
The patent replaces the mechanical stress-decoupling function of thick soft adhesive layers with an electrical compensation system. Instead of using thick adhesive layers that compromise wire bonding, stress-measuring structures are integrated into the carrier, and their output signals are processed by an evaluation circuit to compensate for stress effects, maintaining both precision and reliability.
Solution Approach 2:
The stress-measuring structures serve as intermediary elements that detect stress without requiring thick adhesive layers. These structures provide electrical signals that enable stress compensation while maintaining thin, high-quality adhesive bonding for reliable wire connections and extended service life.
3Measurement precision
If stress relief structures such as milled slots or injection-molded soft material are added to the carrier, then stress-induced errors are compensated, but the base area increases and manufacturing cost rises
Solution Approach 1:
The patent replaces physical stress relief structures like milled slots or injection-molded soft material with an integrated electrical measurement and compensation system. Stress-measuring structures are embedded directly into the carrier substrate without requiring additional base area, and electronic compensation is achieved through signal processing in the evaluation circuit.
Solution Approach 2:
The sensor carrier is designed with multi-functionality: it serves both as the structural support for the sensor element and as the substrate for integrated stress-measuring structures. This eliminates the need for separate stress relief structures, maintaining a compact base area while achieving stress compensation through the combined mechanical-electrical system.
4Measurement precision
If calibration is performed after further installation, then stress-induced errors can be compensated, but manufacturing cost increases
Solution Approach 1:
The patent implements preliminary action by integrating stress-measuring structures and calibration capabilities into the sensor module during manufacturing. The evaluation circuit is pre-configured to process stress compensation, and the system can be calibrated once during production. This eliminates the need for costly post-installation calibration while maintaining high signal accuracy throughout the sensor's service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances sensor precision by accurately accounting for stress and temperature effects, improving signal accuracy and offset compensation regardless of stress origin, suitable for high-precision sensors like inertial and pressure sensors.
Implementation Method 1
the stress-measuring structure to be a piezoelectric or piezoresistive sensor
Implementation Method 2
the stress-measuring structure to be a piezoelectric or piezoresistive sensor
Data Source
AI summary
A sensor carrier having a main plane of extension, a first side parallel to the main plane of extension, a second side parallel to the main plane of extension, which is situated opposite the first side, and at least one electrical contact surface situated on the second side. At least one stress-measuring structure is embedded in the sensor carrier. A sensor module having such a sensor carrier as well as to a component having a sensor module having such a sensor carrier, are also described. A method for calibrating a sensor module and a method for operating a sensor module are also described.