Sensor Casing With Sloped Edge for Contained Potting

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Solution Overview

Problem

Compact sensors face issues with potting compounds running off due to capillarity, complex geometry, and hydrophilic wetting behavior, leading to contamination during the potting process.

Innovation Solution

A sensor casing with a circumferential edge having an outwardly descending slope allows temporary overfilling, forming a stable convex potting compound surface, preventing runoff and facilitating a robust potting process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the receiving space has a complex geometry with concave edges and small dimensions, then the sensor can be compact, but the potting compound runs off during the potting process due to capillarity and hydrophilic wetting behavior

Engineering Contradiction:

Improvesensor sizeVSAvoidpotting compound runoff

Core Design Contradiction:

Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

Instead of trying to prevent the potting compound from entering complex geometric features, the invention inverts the approach by allowing overfilling and using the circumferential edge with outwardly descending slope to redirect the excess compound back into the receiving space. The edge geometry is designed so that the slope angle causes the potting compound to flow back inward rather than run off externally.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The circumferential edge acts as an intermediary element between the receiving space and the external environment. It mediates the potting compound flow by providing a controlled interface where the outwardly descending slope redirects excess compound back into the receiving space, preventing direct contact with external surfaces.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the receiving space is overfilled to ensure complete coverage, then protection against humidity and corrosion is improved, but the potting compound contaminates the product and facility

Engineering Contradiction:

Improveprotection against humidity and corrosionVSAvoidcontamination of product and facility

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention converts the potentially harmful effect of potting compound runoff into a beneficial feature. The outwardly descending slope of the circumferential edge causes excess potting compound to flow back into the receiving space rather than run off externally, transforming what would be contamination into a self-correcting feature that ensures complete coverage.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Object-generated harmful factors

If the circumferential edge has a steep slope to prevent runoff, then potting compound containment is improved, but temporary overfilling cannot be accommodated

Engineering Contradiction:

Improvepotting compound runoff preventionVSAvoidpotting process cycle time

Core Design Contradiction:

Object-generated harmful factorsVSProductivity

Solution Approach 1:

The invention optimizes the slope angle parameter of the circumferential edge to a specific range (20° to 70°) that balances two competing requirements: preventing potting compound runoff while accommodating temporary overfilling during the potting process. This parameter optimization allows the system to achieve both containment and process efficiency.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures stable and efficient potting without contamination, enabling quicker cycle times and compatibility with various sensor designs.

Implementation Method 1

the circumferential edge has an outwardly descending slope which allows temporary overfilling of the receiving space during a potting process, forming a stable convex potting compound surface

Methodology Applied

Scientific EffectSurface tension: Surface Tension

Implementation Method 2

the circumferential edge has an outwardly descending slope which allows temporary overfilling of the receiving space during a potting process

Methodology Applied

Scientific EffectGravity: Gravitation

Implementation Method 3

the combination of the capillarity of small dimensions, a complex geometry and/or concave edges and a hydrophilic wetting behavior can cause the potting compound to run off during the potting process

Methodology Applied

Scientific EffectWetting: Wetting

Data Source

PatentUS12359944B2Sensor casing and method for potting an open receiving space of a sensor casing

Publication Date: 2025.07.15 ROBERT BOSCH GMBH

AI summary

A sensor casing is disclosed that has an open receiving space which has a peripheral edge as a creep barrier at the open end. The receiving space is filled with a potting compound. The cured potting compound forms a concave surface with respect to the peripheral edge. A method for potting an open receiving space of a sensor casing of this kind is also disclosed. The peripheral edge has an outwardly declining slope which allows temporary overfilling of the receiving space during a potting process so as to form a stable convex potting compound surface.