Sensor Chip Cavity Membrane Assembly for Parallel Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for producing sensor devices require individual attachment of membranes to each sensor, which is time-consuming and inefficient, especially when protecting sensors from environmental factors like dust and water while allowing air and water vapor penetration.
Innovation Solution
A method involving a frame structure that surrounds sensor chips on a substrate, forming cavities covered by a membrane, allowing for simultaneous and parallel production of multiple sensor devices, with the frame structure being either prefabricated or directly produced on the substrate, and using an adhesive material for attachment, enabling efficient singulation into individual devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If membranes are attached individually to each sensor in succession, then each sensor receives proper protection and coverage, but the production process becomes time-consuming and inefficient
Solution Approach 1:
Multiple individual membrane attachment operations are merged into a single parallel process. The substrate is divided into multiple regions, each with its own membrane and sensor chip, allowing all membranes to be attached simultaneously rather than sequentially, thereby maintaining quality while dramatically increasing production speed
Solution Approach 2:
The substrate is segmented into multiple independent regions, each capable of being processed independently but simultaneously. This segmentation allows the production system to handle multiple sensor devices in parallel while maintaining the same quality standards as individual processing would provide
2Reliability
If sensors are protected from environmental factors, then sensor reliability improves, but the ability to sense environmental parameters like pressure and humidity is reduced
Solution Approach 1:
The membrane is designed with non-uniform properties: it is generally impermeable to protect the sensor, but contains specific localized regions (holes or permeable areas) that allow certain environmental factors to pass through. This enables the membrane to simultaneously provide protection and environmental access depending on the location and properties of different regions
Solution Approach 2:
The membrane utilizes porous or microporous material structure that allows selective permeation. The pores are sized and distributed to permit passage of specific molecules (like water vapor or gases) while blocking larger particles (like dust), thus enabling both protection and environmental sensing functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient production of multiple sensor devices with enhanced protection from environmental influences while allowing minor influences like pressure fluctuations to penetrate, reducing production time and increasing efficiency compared to traditional individual membrane attachment processes.
Implementation Method 1
a frame structure is attached with an adhesive material on the substrate and between the sensor chips
Implementation Method 2
a membrane that is impenetrable by dust and water but is permeable to air and water vapor
Implementation Method 3
microporous membranes made of expanded polytetrafluoroethylene (ePTFE)
Data Source
AI summary
A method for producing a plurality of sensor devices. The method includes: furnishing a substrate having contact points in a plurality of predetermined regions for sensor chips; disposing the sensor chips in the predetermined regions on the substrate, and electrically contacting the sensor chips to the contact points; attaching a frame structure with an adhesive material on the substrate and between the sensor chips, the frame structure proceeding laterally around the sensor chips, the frame structure extending, after attachment, vertically beyond the sensor chips and forming a respective cavity for at least one of the sensor chips, and a membrane spanning at least one of the cavities for the sensor chips so as to cover it; and singulating the substrate, or the frame structure and the substrate, around the respective cavities into several sensor devices.