Optical Sensor and Charging Coil Integration for Thinner Wearables
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wearable electronic devices face design limitations due to space constraints, particularly when integrating biosensor and wireless charging modules, leading to increased thickness and complexity in their assembly.
Innovation Solution
An integrated module assembly is formed by combining an optical sensor module and a wireless charging module with a flexible printed circuit board, allowing them to be electrically connected and housed within the device, reducing thickness and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the biosensor module and wireless charging module are implemented as separate stacked arrangements, then each module can function independently, but the thickness of the electronic device increases
Solution Approach 1:
The patent combines the optical sensor module and wireless charging module into a single integrated module assembly. The FPCB of the optical sensor module serves as a substrate that the wireless charging coil is disposed on and electrically connected to, creating a unified structure that reduces device thickness while maintaining independent functionality of both modules
Solution Approach 2:
The wireless charging coil is disposed on the FPCB of the optical sensor module, with the optical sensor components positioned on one surface and the wireless charging coil positioned on the same or opposite surfaces, creating a nested arrangement where one module is integrated within the structure of the other module's substrate
2Adaptability or versatility
If separate biosensor module and wireless charging module are used, then design flexibility is maintained, but the assembly process becomes more complex
Solution Approach 1:
By integrating the wireless charging module with the optical sensor module through shared FPCB substrate and electrical connections, the patent reduces the number of separate assembly operations. The module assembly is treated as a single unit that can be mounted to the circuit board as one component, simplifying the assembly process while maintaining design flexibility through the modular nature of the integration
3Reliability
If separate modules are used with individual circuit boards, then electrical connection reliability is maintained, but interior space for other components is reduced
Solution Approach 1:
The patent merges the circuit board functions of both modules into a single FPCB substrate. The FPCB provides electrical connections for both the optical sensor components (light emitting part, light receiving part) and the wireless charging coil, eliminating the need for separate circuit boards and thereby increasing interior space for other device components while maintaining reliable electrical connections through the unified substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the overall device thickness, enhances interior space for other components, lowers manufacturing costs, and simplifies the assembly process, thereby reducing potential defects.
Implementation Method 1
the light emitting part emits light in the second direction, and the light receiving part receives emitted light reflecting off the external object
Implementation Method 2
a wireless charging module surrounding the FPCB and at least partially coupled to the FPCB so as to be integrated with the FPCB
Data Source
AI summary
A wearable electronic device, for example a smart watch, has an optical sensor module disposed near a side of the device meant to face the wearer. The device also includes a wireless charging module. The optical sensor and wireless charging modules are at least partially integrated together via a flexible printed circuit board (“FPCB”) which is connected to both modules. The wireless charging module surrounds the FPCB of the optical sensor module, thus allowing a reduction in thickness of the wearable device and further allowing simplification in a process of assembly of the device.