Integrated Sensor and Charging Module Assembly for Slim Wearables
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Solution Overview
Problem
Wearable electronic devices face design limitations due to size constraints, particularly when integrating biosensor and wireless charging modules, leading to increased thickness and complexity in component arrangement.
Innovation Solution
The optical sensor module is implemented as a chip-on-board (COB) sensor, and the wireless charging module is integrally formed with the optical sensor module, both electrically connected to the circuit board, allowing for a simplified assembly process and reduced device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a camera module and flash module are separately disposed, then each module can be optimized independently, but the overall device size increases and assembly complexity increases
Solution Approach 1:
The patent combines the camera module and flash module into a single integrated module assembly. The flash module is positioned adjacent to the camera module within the same assembly, allowing both modules to share common structural support and optical elements while maintaining independent functional optimization. This merging reduces the overall device volume compared to separate disposal while preserving individual module performance characteristics.
Solution Approach 2:
The integrated module assembly serves multiple functions simultaneously - it houses both the camera module for image capture and the flash module for illumination. The shared structural framework and common mounting interface provide universal support for both modules, reducing redundant components and simplifying the overall assembly structure while maintaining independent optimization capabilities for each functional module.
2Reliability
If a camera module and flash module are separately disposed, then each module can be optimized independently, but the assembly complexity increases
Solution Approach 1:
By merging the camera module and flash module into a single integrated assembly with a common structural framework and shared mounting interface, the patent reduces the number of separate assembly operations required. The integrated design allows both modules to be installed and aligned simultaneously, reducing assembly complexity compared to separately disposing each module while maintaining independent optimization capabilities.
3Volume of moving object
If modules are integrated into a compact assembly, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent applies local quality by providing dedicated heat dissipation structures specifically for the flash module within the integrated assembly. The flash module, which generates significant heat, is equipped with its own heat dissipation components positioned in close proximity, allowing efficient thermal management in the compact integrated structure without compromising overall heat dissipation performance.
Data Source
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AI summary
An electronic device is provided. The electronic device includes a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.