Sensor Chip Adhesive Bonding for Molding Leakage Prevention
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Solution Overview
Problem
The existing methods for manufacturing sensor apparatuses with insulating materials face challenges in achieving high production yield and efficiency due to the need for precise attachment of tiny buffer members, which complicates the process and reduces accuracy.
Innovation Solution
A method involving a sensor chip with a terminal, a housing with a bonding member, and an adhesive member is used, where the sensor chip is placed in a housing with a receive space, and the adhesive member is pressed to form a clearance, allowing for injection molding without gaps, thus preventing molding material leakage and improving yield and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a tiny buffer member is used to prevent molding material leakage, then molding material leakage is prevented, but high dimensional accuracy is required for the buffer member and its attachment part, which reduces production yield
Solution Approach 1:
The invention extracts and eliminates the buffer member from the assembly, replacing it with a bonding member that performs the sealing function differently. The bonding member is integrated into the housing structure and bonds the sensor chip directly to the housing, eliminating the need for a separate buffer member and its associated high precision attachment requirements.
Solution Approach 2:
The bonding member serves multiple functions: it bonds the sensor chip to the housing, prevents molding material leakage, and provides structural support. This multi-functionality replaces the separate buffer member that only provided leakage prevention, simplifying the overall structure and reducing precision requirements.
2Object-affected harmful factors
If a tiny buffer member is used to prevent molding material leakage, then molding material leakage is prevented, but the attachment process becomes complex and time-consuming, which reduces production efficiency
Solution Approach 1:
The invention merges the bonding function and the leakage prevention function into a single bonding member. This eliminates the need for separate buffer member attachment steps, reducing process complexity and improving production efficiency while still preventing molding material leakage.
Solution Approach 2:
By removing the buffer member entirely and using the bonding member for both bonding and sealing functions, the invention reduces the number of components and assembly steps, directly improving production efficiency.
3Object-affected harmful factors
If a buffer member is attached with high accuracy, then molding material leakage is prevented, but the complexity of the attachment process increases, which reduces production yield
Solution Approach 1:
The invention extracts and eliminates the buffer member from the assembly, replacing its leakage prevention function with the bonding member. This simplifies the device structure and reduces attachment process complexity while maintaining effective leakage prevention.
Solution Approach 2:
The bonding member is designed to perform both bonding and leakage prevention functions, eliminating the need for a separate buffer member and simplifying the overall device structure and attachment process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances production yield and efficiency by eliminating gaps between the mold and the sensor chip, housing, and adhesive member, allowing for precise assembly without the need for a buffer member, thereby improving the accuracy and reliability of the sensor apparatus.
Implementation Method 1
placing an adhesive member on one of the bonding member and a back surface of the sensor chip; and placing the sensor chip in the receive space through the first opening so that the sensing member is exposed
Implementation Method 2
forming, by injection molding, a molded member that covers the predetermined portion including a connection part where the terminal and the electric conductive member are connected with each other
Data Source
AI summary
A sensor apparatus and a method of manufacturing the same are disclosed. The sensor apparatus includes: a sensor chip; a housing receiving the sensor chip; an electric conductive member connected with a terminal of the sensor chip; and a molded member covering a covered portion including a connection portion where the terminal and the electric conductive member are connected. The sensor chip is bonded to a bonding member of the housing via an adhesive member. A surface of the housing, a surface of the adhesive member, and a front surface of the sensor chip are in the same plane at a boundary part of the covered portion.