Sensor Chip Breaking Strength Inspection Using Segmented Pressure
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Solution Overview
Problem
Conventional sensor chip inspection apparatuses struggle to accurately determine the breaking strength of individual sensor chips due to the need for high pressure, which causes stress concentration and potential breakage of the semiconductor wafer, and require separate setups and large pressure chambers for effective inspection.
Innovation Solution
A sensor chip breaking strength inspection apparatus and method that uses a nozzle to emit a medium at a pressure equivalent to the standard breaking strength of the sensor chips during the dicing process, allowing for simultaneous breaking strength inspection without degrading the sensor chips and integrating with the cleaning process, utilizing a stage, pressure gauge, and vacuum line to apply uniform pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If gas pressure is applied to the entire surface of the semiconductor wafer to find sensor chip breaking strength, then the breaking strength can be inspected, but the force acting on the entire surface becomes large causing stress concentration and the semiconductor wafer breaks
Solution Approach 1:
The patent divides the inspection process into two stages: first applying low pressure (e.g., 1 atm) to all sensor chips, then selectively applying high pressure (e.g., 10 atm) only to chips that showed deformation at low pressure. This segmentation allows breaking strength inspection without subjecting the entire wafer to excessive force that would cause stress concentration and breakage.
Solution Approach 2:
The patent applies different pressure levels to different regions of the semiconductor wafer based on their individual characteristics. Chips showing deformation at low pressure are targeted for high pressure inspection, while chips showing no deformation remain at low pressure. This local differentiation enables breaking strength measurement without concentrating excessive stress on the entire wafer structure.
2Measurement precision
If a large-scale pressure chamber is used to apply pressure greater than atmospheric pressure, then sensor chip breaking strength can be inspected, but costs and inspection time are increased
Solution Approach 1:
The patent segments the pressure application process into sequential stages rather than requiring a single large pressure chamber. A low pressure stage (1 atm) is applied to all chips first, followed by a high pressure stage (10 atm) only for selected chips. This eliminates the need for a large-scale pressure chamber while maintaining inspection accuracy.
Solution Approach 2:
The patent performs a preliminary low pressure inspection before the high pressure inspection. By first applying low pressure to identify chips that show deformation, the system can selectively apply high pressure only to those chips, avoiding the need for a large pressure chamber and reducing both cost and time.
3Measurement precision
If separate sensor chip breaking strength inspection process is set up, then breaking strength can be determined, but inspection time is increased
Solution Approach 1:
The patent merges the breaking strength inspection with the existing low pressure inspection process. Both functions are performed in a single integrated process rather than as separate steps, allowing the system to determine both deformation characteristics and breaking strength without requiring additional time for a separate inspection process.
Solution Approach 2:
The patent performs the low pressure inspection as a preliminary action that serves dual purposes: it identifies chips showing deformation and prepares the system for subsequent high pressure inspection. This preliminary action eliminates the need for a separate breaking strength inspection process, reducing overall inspection time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective breaking strength inspection of sensor chips without degrading their strength, allowing for reliable identification of suitable chips for production and reducing inspection time and costs by integrating the inspection into the cleaning process.
Implementation Method 1
a nozzle (20) that emits a medium onto sensor chips (29) at a pressure equivalent to a standard breaking strength of the sensor chips (29)
Implementation Method 2
a vacuum line (24) that applies vacuum to the semiconductor wafer (8)
Data Source
AI summary
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.