Sensor Chip Busbar Galvanic Isolation via Dielectric Spacing
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Solution Overview
Problem
Existing sensor devices face challenges in maintaining reliable galvanic isolation and preventing leakage currents due to the close proximity between the busbar and the sensor chip, which can lead to operational outages.
Innovation Solution
The sensor device incorporates a dielectric layer spaced from the busbar along its entire periphery, creating a creepage path that increases the distance between the busbar and the sensor chip, enhancing galvanic isolation and resilience to leakage currents, while allowing for contactless measurement of the magnetic field induced by the electric current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the sensor chip is placed close to the busbar for compact design, then device complexity is reduced, but galvanic isolation reliability deteriorates and leakage currents increase
Solution Approach 1:
A dielectric layer is introduced as an intermediary component between the busbar and the sensor chip. This dielectric layer provides both mechanical support and electrical insulation, enabling the sensor chip to be positioned close to the busbar for compact design while maintaining reliable galvanic isolation and preventing leakage currents.
2Reliability
If the distance between busbar and sensor chip is increased to prevent leakage currents, then galvanic isolation is improved, but device size increases
Solution Approach 1:
The dielectric layer acts as a mediator that provides sufficient electrical insulation and creepage path length for high resilience to leakage currents, while its thin profile maintains a compact device footprint. The dielectric material properties enable achieving both isolation reliability and space efficiency simultaneously.
Solution Approach 2:
Instead of increasing the horizontal distance between busbar and sensor chip, the solution moves the isolation function to the vertical dimension by introducing a dielectric layer. This dimensional transition allows maintaining close proximity in the plane while achieving sufficient isolation through the thickness of the dielectric layer.
3Reliability
If a dielectric layer is added between busbar and sensor chip, then galvanic isolation is enhanced, but device complexity increases
Solution Approach 1:
The dielectric layer is designed to perform multiple functions simultaneously: providing mechanical support for the sensor chip, ensuring galvanic isolation between busbar and sensor chip, preventing leakage currents, and maintaining compact device dimensions. This multi-functionality reduces the need for additional separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively improves the reliability of the sensor device by reducing the risk of operational outages and maintaining accurate magnetic field measurements through enhanced galvanic isolation and increased creepage distances.
Implementation Method 1
the sensor chip is designed to measure a magnetic field induced by the electric current flowing through the busbar
Data Source
AI summary
A sensor device comprises a busbar, a dielectric arranged on the busbar, and a sensor chip arranged on the dielectric, wherein the sensor chip is designed to measure a magnetic field induced by an electric current flowing through the busbar, wherein the surface of the dielectric facing toward the busbar is spaced from the busbar in an area along the entire periphery of the dielectric.