Sensor Chip Calibration Lead Frame Design
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Solution Overview
Problem
Developing and manufacturing inexpensive and accurate magnetic field sensors is challenging due to the need for expensive and non-standardized calibration and testing means, particularly for angle or 3D sensors which require complex calibration devices.
Innovation Solution
A packaged sensor chip with a lead frame structure that includes conductive structures to generate a calibration magnetic field, eliminating the need for dedicated calibration lines and allowing for a flatter design with reduced current requirements, where the lead frame's connecting webs serve both as a mechanical connection and calibration terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If dedicated calibration lines are used to generate magnetic field for calibration, then calibration accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The lead frame is designed to serve dual functions: as the mechanical support structure for the sensor element and as the calibration current path that generates the magnetic field. The conductive structures of the lead frame are used both for electrical connection and for generating calibration magnetic field when calibration current flows through them, eliminating the need for separate dedicated calibration lines.
Solution Approach 2:
The invention merges the calibration function with the existing lead frame structure. Instead of adding separate calibration components, the calibration current path is integrated into the lead frame's conductive structures, combining the support function and calibration function into a single unified structure.
2Measurement precision
If high current is used to generate sufficient magnetic field density for calibration, then calibration effectiveness is improved, but energy consumption and heat generation increase
Solution Approach 1:
The invention changes the geometric parameters of the lead frame's conductive structures to optimize magnetic field generation. By adjusting dimensions such as wire thickness, loop area, and distance from the sensor element, the magnetic field density is optimized to achieve effective calibration with reduced calibration current, thereby lowering energy consumption and heat generation.
3Ease of operation
If calibration terminals are arranged on opposing sides of the package, then ease of connection is improved, but device footprint increases
Solution Approach 1:
The invention utilizes the three-dimensional space within the package by arranging calibration terminals on opposing sides of the package along different edges. This spatial arrangement allows external connections to be made from opposite directions, improving ease of connection and assembly while maintaining a compact footprint, as the terminals are positioned at the periphery rather than requiring additional lateral space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the current needed for calibration, minimizes production costs, and enhances measurement reliability by allowing for easier and more accurate calibration of sensor elements, reducing the need for specialized calibration equipment and enabling cost-effective production of magnetic field sensors.
Implementation Method 1
the conductive structures are structured so as to generate a calibration magnetic field for the sensor element when a current flows through them
Implementation Method 2
a sensor element that is designed to generate a sensor signal that depends on a magnetic field to which the sensor element is exposed
Data Source
AI summary
A packaged sensor chip includes a lead frame to which there is attached a sensor element designed to generate a sensor signal that depends on a magnetic field to which the sensor element is exposed; and a package therefor, wherein the lead frame has function terminals and wherein the lead frame has at least two calibration terminals that are arranged on two other opposing sides of the package, wherein the lead frame has conductive structures that connect the at least two calibration terminals, wherein the conductive structures are structured so as to generate a calibration magnetic field for the sensor element when a current flows through them, and wherein the conductive structures are part of a connection structure that connects a plurality of lead frames before the plurality of lead frames are disconnected from one another in a first direction in which the other two sides are opposite one another.