Sensor Chip Cavity Design for Thermal Expansion Matching
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Solution Overview
Problem
Existing sensor chip devices face limitations in design flexibility and manufacturing efficiency, particularly in integrating multiple components and achieving optimal thermal expansion matching between sensor chips and substrates, which affects performance and reliability in applications like automotive systems.
Innovation Solution
The proposed solution involves a device structure with a sensor chip embedded in a cavity formed by a substrate and a laminated material layer, including a prepreg material with glass fibers, and a housing for electrical and magnetic shielding, allowing for flexible chip placement and efficient fabrication processes, including the use of flip-chip techniques and through-hole formation for signal access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sensor chips are manufactured on the microscopic scale and integrated into semiconductor chips, then technological progress and sensor density are improved, but design flexibility and manufacturing efficiency are limited
Solution Approach 1:
The device is divided into distinct functional components: substrate, sensor chip, material layer, and housing. This segmentation allows each component to be optimized independently while maintaining overall system flexibility and manufacturability.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking with the sensor chip positioned above the substrate and enclosed by the housing. This vertical arrangement provides design freedom while maintaining microscopic sensor precision.
2Manufacturing precision
If sensor chips are manufactured on the microscopic scale, then sensor density is improved, but manufacturing efficiency is limited
Solution Approach 1:
The sensor chip is pre-manufactured with microscopic precision on separate wafers before being transferred and mounted onto the substrate. This preliminary fabrication allows high-precision manufacturing to be performed independently, improving overall manufacturing efficiency.
Solution Approach 2:
The material layer acts as an intermediary between the substrate and sensor chip, facilitating their integration. This intermediary layer simplifies the manufacturing process by providing a standardized interface for mounting pre-fabricated sensor chips.
3Adaptability or versatility
If multiple components are integrated into the device, then functionality is improved, but device complexity increases
Solution Approach 1:
Multiple functional components (substrate, sensor chip, material layer, housing) are merged into a single integrated device structure. This combining approach maintains versatility while managing complexity through systematic integration.
Solution Approach 2:
The housing serves multiple functions: it encloses the sensor chip, provides structural support, and enables magnetic shielding. This multi-functionality reduces the number of separate components needed, thereby managing device complexity.
4Reliability
If thermal expansion matching between sensor chips and substrates is optimized, then reliability is improved, but manufacturing flexibility is reduced
Solution Approach 1:
The material layer serves as a thermal expansion intermediary between the substrate and sensor chip. It can be designed with specific thermal properties to match and bridge the thermal expansion coefficients of the substrate and sensor chip, ensuring reliability while maintaining assembly flexibility.
Solution Approach 2:
The material layer's thermal expansion parameters can be adjusted to optimize the thermal match between substrate and sensor chip. By changing the material composition or thickness of this layer, thermal compatibility is achieved without constraining other assembly parameters.
Data Source
AI summary
An electrical device and method is disclosed. One embodiment provides a substrate, a sensor chip disposed completely above a plane section of a surface of the substrate. A structurally homogeneous material layer is disposed above the substrate and the sensor chip. A cavity is formed between the substrate and the material layer. The sensor chip is disposed inside the cavity.