Sensor Chip Package Structure with Exposed Active Region
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Solution Overview
Problem
Existing optical sensor package modules have a covered sensing region, which affects fingerprint identification accuracy and increases module thickness, hindering integration with portable devices.
Innovation Solution
A sensor chip package structure with an exposed active region and a concave portion on the sensor chip to accommodate a light-emitting element, allowing direct exposure and reducing the distance between the light-emitting element and the active region, while maintaining a compact module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sensing region is covered by glass or transparent material to protect the chip, then the chip is protected and fixed, but the identification accuracy is impacted and the module thickness increases
Solution Approach 1:
The patent extracts the protective covering (glass or transparent material) from over the sensing region, allowing the active region to be directly exposed. This enables the sensing region to be touched by objects like fingers for accurate fingerprint identification, while the chip remains protected through alternative packaging structures.
2Reliability
If the sensing region is covered by transparent material, then the chip is protected, but the module thickness increases which hinders integration with portable devices
Solution Approach 1:
The patent removes the transparent covering material from the sensing region, eliminating the additional thickness it would add to the module. This enables thinner sensor package designs that are more suitable for integration into portable electronic devices.
3Measurement precision
If the active region is exposed without covering material, then identification accuracy improves and module thickness reduces, but the chip becomes more vulnerable to damage
Solution Approach 1:
The patent segments the packaging approach by applying different treatments to different regions: the sensing region is left exposed for accurate fingerprint identification, while other parts of the chip are properly packaged and protected. This selective packaging maintains both sensing performance and chip protection.
Data Source
AI summary
A manufacturing method of a sensor chip package structure is provided. In the manufacturing method, a wafer including a plurality of sensor chips is provided, and each sensor chip has an active region and defines a pre-thinned region thereon. Each pre-thinned region is located at one side of the active region and covers a boundary line of each sensor chip. The pre-thinned region of each sensor chip is etched to form a concave portion. A redistribution layer is formed on the wafer. Subsequently, the wafer is cut to separate the sensor chips from one another, and each separated sensor chip has a wiring layer extending from the active region along a sidewall surface to a bottom surface of the concave portion. The separated sensor chips are respectively mounted on a plurality of substrates, and the active region is electrically connected to the substrate through the wiring layer.