Sensor Chip Housing with Ceramic Glass and Mold Compound

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Solution Overview

Problem

Existing sensor chips face challenges with stress effects and environmental exposure due to mismatched thermal expansion coefficients and lack of protection, which can impact their functionality and durability, especially in sensitive MEMS and Hall Effect sensors.

Innovation Solution

A sensor chip housing structure made of ceramic or glass materials with a similar thermal expansion coefficient, encapsulated with a mold compound, providing electrical connections and protection while reducing stress effects and environmental influences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sensor chips are manufactured on semiconductor chips without protective encapsulation, then manufacturing precision and sensor functionality are maintained, but the sensors are exposed to environmental factors causing stress effects and reduced reliability

Engineering Contradiction:

Improvesensor reliabilityVSAvoidenvironmental exposure

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a mold compound as an intermediary protective layer between the sensor chip and the external environment. This mold compound encapsulates the sensor chip, providing mechanical protection and isolating it from harmful environmental factors such as moisture, dust, and thermal stress, thereby improving reliability without affecting sensor functionality

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite material structures combining the semiconductor substrate, sensor chip, and mold compound. This multi-material approach allows each layer to provide its specific function: the semiconductor substrate provides electrical properties, the sensor chip provides sensing functionality, and the mold compound provides environmental protection and stress relief

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If thermal expansion coefficients of housing materials are mismatched with sensor chips, then ease of manufacture is improved, but stress effects increase impacting sensor functionality

Engineering Contradiction:

Improvehousing material selectionVSAvoidsensor chip stress control

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the thermal expansion parameter by selecting housing and substrate materials with thermal expansion coefficients specifically matched to the sensor chip material. This parameter matching minimizes thermal stress during temperature variations, preventing deformation and maintaining sensor precision while still allowing ease of manufacture

Inventive Principle:

Principle #35Parameter changes

3Object-affected harmful factors

If sensor chips are fully encapsulated with mold compound, then protection from environmental factors is improved, but electrical connections become more complex

Engineering Contradiction:

Improveenvironmental protectionVSAvoidelectrical connection structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent implements a nested structure where the sensor chip is embedded within the substrate, and both are encapsulated within the mold compound. The electrical connections are integrated into this nested structure through conductive pathways in the substrate and contact elements that penetrate or interface with the mold compound, organizing complexity in a hierarchical manner

Inventive Principle:

Principle #7Nested doll (Nesting)

4Reliability

If stress effects are minimized through material matching, then sensor functionality is improved, but manufacturing adaptability is reduced

Engineering Contradiction:

Improvesensor functionalityVSAvoidmaterial selection flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by matching thermal expansion coefficients specifically at critical interfaces (sensor chip to substrate, substrate to housing) while allowing other material properties to vary for manufacturing advantages. This localized material optimization ensures stress-free operation at sensitive interfaces while maintaining overall manufacturing adaptability and flexibility

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively minimizes stress-induced errors and protects the sensor chips from environmental factors, enhancing their reliability and functionality by matching thermal expansion coefficients and using a protective mold compound.

Implementation Method 1

a structure (2) housing the sensor chip (1), wherein the structure (2) is made of a ceramic or a glass material or combinations thereof having a thermal expansion coefficient similar or close to the thermal expansion coefficient of the sensor chip (1)

Methodology Applied

Scientific EffectThermal expansion coefficient matching: Thermal Expansion

Implementation Method 2

The sensor chip is housed in a structure made of a ceramic or a glass material or combinations thereof. The structure is covered by a mold compound

Methodology Applied

Scientific EffectEncapsulation:

Data Source

PatentUS7836764B2Electrical device with covering

Publication Date: 2010.11.23 INFINEON TECHNOLOGIES AG

AI summary

The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.