Sensor Chip Integrated Circuit Package Reducing PCB Footprint
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Solution Overview
Problem
Conventional sensing devices with central processing architecture require multiple sensor chips connected to a common semiconductor chip, leading to limited throughput and increased manufacturing costs due to individual packaging of sensor chips and integrated circuits, resulting in a larger PCB footprint.
Innovation Solution
A semiconductor package with a multi-layer substrate integrating a sensor chip and an integrated circuit in a flip-chip manner, where the sensor chip is electrically connected to contact pads on the substrate surface and encapsulated with a transparent covering member, allowing for parallel processing and reduced PCB footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple sensor chips are connected to a common semiconductor chip using conventional individual packaging, then electrical connection and signal processing are achieved, but the PCB footprint increases and manufacturing cost increases
Solution Approach 1:
The patent merges multiple sensor chips and integrated circuits into a single integrated package structure. The package substrate integrates multiple contact pads that simultaneously connect to multiple sensor chips and integrated circuits, eliminating the need for separate individual packaging of each component. This consolidation reduces the overall PCB footprint while maintaining all necessary electrical connections.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides mechanical support for multiple sensor chips and integrated circuits, establishes electrical connections between all components, and enables parallel signal processing. This multi-functional integration reduces the number of separate components and packaging structures needed, thereby reducing PCB footprint.
2Ease of manufacture
If multiple sensor chips are connected to a common semiconductor chip using conventional individual packaging, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple sensor chips and integrated circuits into a single integrated package, allowing for streamlined manufacturing processes. Instead of individually packaging each component separately, the integrated structure enables batch processing and reduces the number of assembly steps, thereby lowering manufacturing costs despite the increased packaging complexity.
3Productivity
If a central processing architecture is used with multiple sensor chips connected to a common semiconductor chip, then signal processing is achieved, but throughput is limited
Solution Approach 1:
The patent segments the processing architecture by providing multiple integrated circuits within the package, each capable of independently processing signals from corresponding sensor chips. This segmentation enables parallel signal processing, where multiple processing operations occur simultaneously, thereby increasing overall throughput compared to a single central processing unit.
Solution Approach 2:
The patent transitions from a single-dimension sequential processing architecture to a multi-dimensional parallel processing architecture. By arranging multiple sensor chips and multiple integrated circuits in a two-dimensional array on the package substrate, the system enables simultaneous processing of multiple signal streams, effectively adding a spatial dimension to the processing capability and increasing throughput.
Data Source
AI summary
A semiconductor package and a method for forming a semiconductor package are disclosed. The semiconductor package includes a multi-layer package substrate having interconnect structures embedded therein. A sensor chip having an image sensing element is disposed on a top surface of the package substrate, and an integrated circuit is mounted to a bottom surface of the package substrate. The integrated circuit is a flip-chip assembly. The sensor chip is electrically connected to the integrated circuit. An adhesive material bonds a transparent covering member to the sensor chip to enclose the image sensing element.